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Conductive silver paste capable of being sintered at low temperature and preparation method therefor

Inactive Publication Date: 2016-04-06
SHANGHAI IND TECH INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the structure of the alloy itself, it is relatively brittle and less elastic than lead solder
Moreover, the defect rate of tin bridge, empty soldering, pinhole, etc. is higher than that of tin-lead solder

Method used

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  • Conductive silver paste capable of being sintered at low temperature and preparation method therefor
  • Conductive silver paste capable of being sintered at low temperature and preparation method therefor

Examples

Experimental program
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Effect test

preparation example Construction

[0042] The preparation steps of nanoscale silver wire among the present invention are as follows:

[0043] Step 1: Mix the silver salt solution with 100ml of ethylene glycol to obtain a mixed solution A with a mass percentage of 5% to 35%;

[0044] Step 2: Mix the protective agent with 100ml of ethylene glycol to obtain a mixed solution B with a mass percentage of 5%~35%;

[0045] Step 3: preparing an inorganic substance ethylene glycol solution with a mass percentage of 0.015% to 1.53% as a control agent;

[0046] Step 4: Take 60ml of ethylene glycol in the lining of 100ml polytetrafluoroethylene, add 0.1~0.5ml of control agent, stir evenly at room temperature, then add mixed solution A and mixed solution B, and continue to stir evenly to obtain mixed solution C;

[0047] Step 5: Put 100ml of polytetrafluoroethylene lining with mixed solution C into the reactor shell, react at 140°C~180°C for 1~3 hours, and cool down with the furnace to obtain the reaction solution;

[004...

Embodiment 1

[0058] Embodiment 1 adopts micron beaded silver powder to prepare:

[0059] Preparation of nano-scale silver wire:

[0060] Step 1: 10.2g silver nitrate is mixed with 100ml ethylene glycol to obtain a solution A with a mass percentage of 8.39%;

[0061] Step 2: Mix 10.8g polyvinylpyrrolidone with 100ml ethylene glycol to obtain a solution B with a mass percentage of 8.84%;

[0062] Step 3: preparation mass percent is the ethylene glycol solution of the cupric chloride of 0.077%, as control agent;

[0063] Step 4: Take 60ml of ethylene glycol in the lining of 100ml of polytetrafluoroethylene, add 0.1ml of the control agent in step 3, stir evenly at room temperature, then add mixed solution A and mixed solution B, continue to stir evenly , to obtain a mixed solution C;

[0064] Step 5: Put 100ml of polytetrafluoroethylene lining with mixed solution C into the reaction kettle, react at 160°C for 1 hour, and cool with the furnace to obtain the reaction solution;

[0065] Step ...

Embodiment 2

[0074] Embodiment 2 is prepared by adopting micron flake silver powder:

[0075] Preparation of nano-scale silver wire:

[0076] Step 1: 10.2g silver nitrate is mixed with 100ml ethylene glycol to obtain a solution A with a mass percentage of 8.39%;

[0077] Step 2: Mix 10.8g polyvinylpyrrolidone with 100ml ethylene glycol to obtain a solution B with a mass percentage of 8.84%;

[0078] Step 3: preparation mass percentage is the ethylene glycol solution of the sodium chloride of 0.052%, as control agent;

[0079] Step 4: Take 60ml of ethylene glycol in the lining of 100ml of polytetrafluoroethylene, add 0.4ml of the control agent in step 3, stir evenly at room temperature, then add 3ml of solution A and 3ml of solution B, continue Stir evenly to obtain mixed solution C;

[0080] Step 5: Put 100ml of polytetrafluoroethylene lining with mixed solution C into the reaction kettle, react at 160°C for 1 hour, and cool with the furnace to obtain the reaction solution;

[0081] St...

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Abstract

The invention relates to the technical field of electronic paste, and specifically discloses conductive silver paste capable of being sintered at a low temperature and a preparation method therefor. A preparation formula including non-granular conductive ink, micron silver powder, nanoscale silver wires and organic carrier, and a new preparation method are adopted, so that the sintering temperature of the prepared conductive silver paste is reduced to 90-150 DEG C; and the conductivity of the conductive silver paste is improved as well; the square resistance of the conductive silver paste is reduced to 0.012 omega, so that the conductive silver paste can replace the conventional solder to reduce harm on environment and human body; and meanwhile, the conductive silver paste is extremely high in adhesion and suitable for the printing electronic industry.

Description

technical field [0001] The invention relates to the technical field of electronic paste, in particular to a low-temperature sinterable conductive silver paste and a preparation method thereof. Background technique [0002] The traditional conductive silver paste is composed of a conductive phase, a binder phase, and an organic vehicle. Conductive silver paste can generally be divided into two categories, namely polymer conductive silver paste and sintered conductive silver paste. The polymer conductive silver paste is dried or cured to form a film, and the organic polymer is used as the bonding phase. The sintering temperature of the sintered conductive paste is usually greater than 500°C, and glass powder or oxide is used as the bonding phase. Conductive silver paste has a wide range of applications, mainly used in the manufacture of thick film integrated circuits, resistors, resistor networks, capacitors, MLCC, conductive inks, solar cell electrodes, LED cold light sourc...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B13/00
CPCH01B1/02H01B13/00
Inventor 朴贤卿蔡亚果孙卓张哲娟高维
Owner SHANGHAI IND TECH INST
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