A kind of composite plate and its production method
A composite board, bamboo and wood technology, applied in the field of building materials, can solve the problems of non-flame retardant, poor strength, non-waterproof, etc., and achieve the effect of increasing strength and preventing cracking
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Embodiment 1
[0025] Example one: such as figure 1 The structure diagram of the composite board of the present invention shown is a 0.6mm thick oak tempered wood. The first layer: 0.45mm thick oak panel, the back is glued with non-woven fabric; the second layer: 0.05m thick high molecular weight glue dipping paper; the third layer: 0.2mm thick kraft paper; the fourth layer: 0.1mm thick small molecular weight glue dipping Glue paper, 5th layer, 0.5mm thick poplar veneer, 6th layer: 0.1mm thick small molecular weight glue dipped paper.
[0026] Large molecular weight glue components include melamine 50%-55%, plasticizer 35%-40%, formaldehyde 3%-5%; small molecular weight glue components include melamine 70%-82%, plasticizer 5%- 12%, formaldehyde 3%-6%; the non-woven fabric or glass fiber net bonded on the back of the surface layer can prevent the surface layer from cracking. The number of non-woven fabric or glass fiber network depends on the material type, and the thickness is 0.45mm oak panel ...
Embodiment 2
[0034] Embodiment two: such as figure 2 The structure diagram of the composite board of the present invention shown is a black walnut tempered wood with a thickness of 1.1 mm. The first layer: 0.5mm thick black walnut panel, the back is bonded with non-woven fabric; the second layer: 0.05m thick high molecular weight glue dipped paper; the third layer: 0.2mm thick kraft paper; the fourth layer: 0.1mm thick small molecular weight glue Impregnated paper, 5th layer: 0.8mm thick poplar veneer, 6th layer: 0.1mm thick small molecular weight glue dipping paper, 7th layer: 0.8mm thick poplar veneer, 8th layer: 0.1mm thick small molecular weight glue dipping paper.
[0035] Large molecular weight glue components include melamine 50%-55%, plasticizer 35%-40%, formaldehyde 3%-5%; small molecular weight glue components include melamine 70%-82%, plasticizer 5%- 12%, formaldehyde 3%-6%; 0.5mm black walnut panel is pasted with 20 mesh non-woven fabric on the back to prevent surface cracking. ...
Embodiment 3
[0043] Example three: such as image 3 The structure diagram of the composite board of the present invention shown is a black walnut tempered wood with a thickness of 2.1 mm. The first layer: 0.5mm thick black walnut panel, the back is bonded with non-woven fabric; the second layer: 0.05m thick high molecular weight glue dipped paper; the third layer: 0.2mm thick kraft paper; the fourth layer: 0.1mm thick small molecular weight glue Impregnated paper, 5th layer: 0.8mm thick poplar veneer, 6th layer: 0.1mm thick small molecular weight glue dipping paper, 7th layer: 0.8mm thick poplar veneer, 8th layer: 0.1mm thick small molecular weight glue dipping Paper, the 9th layer: 0.8mm thick poplar veneer, the 10th layer: 0.1mm thick small molecular weight glue dipped paper, the 11th layer: 0.8mm thick poplar veneer, the 12th layer: 0.1mm thick small molecular weight glue dipped paper.
[0044] Large molecular weight glue components include melamine 50%-55%, plasticizer 35%-40%, formaldehy...
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Abstract
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