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Two-layer-method two-sided flexible copper clad plate

A flexible copper-clad laminate, double-sided technology, applied in the field of two-layer double-sided flexible copper-clad laminates, can solve the problems of TPI performance, high process requirements, complex process, etc., and achieve excellent copper foil bonding Good quality and compressibility, high product qualification rate, and the effect of simplifying the production process

Inactive Publication Date: 2016-04-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production method of the latter structure is similar to the preparation method of Nippon Steel Chemical Co., Ltd., through the coating process, PI, TPI, and PI are coated on the copper foil successively, and then continuously pressed with the copper foil to prepare double-sided flexible copper clad laminates; Although it avoids the impact of the lack of TPI to a certain extent, it is difficult to completely avoid the problems caused by the lack of TPI performance, and this structure has high requirements for the formulation of TPI and PI, as well as the production process, which increases the production capacity. difficulty
To sum up, due to the constraints of the multi-layer structure, the above-mentioned adhesive-free double-sided panels with different structures require multiple coatings, the process is relatively complicated, and the finished product is relatively high.

Method used

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  • Two-layer-method two-sided flexible copper clad plate

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0038] A two-layer double-sided flexible copper clad laminate, comprising two upper and lower copper foil layers and a polyimide insulating layer sandwiched between the two copper foil layers; its preparation method includes the following steps:

[0039] (1) synthesizing a thermosetting polyamic acid resin glue and a thermoplastic polyamic acid resin glue, and carrying out chemical imidization of the thermoplastic polyamic acid resin glue to obtain a soluble thermoplastic polyimide powder;

[0040] (2) Dissolving the soluble thermoplastic polyimide powder in a polar solvent to obtain a thermoplastic polyimide glue, mixing the thermoplastic polyimide glue with the thermosetting polyamic acid resin glue to obtain Thermosetting polyamic acid-thermoplastic polyimide mixture;

[0041] (3) Provide copper foil, coat the thermosetting polyamic acid-thermoplastic polyimide mixture on one of the surfaces of the copper foil, and then dry the coating to obtain thermosetting polyamic acid-...

Synthetic example 1

[0051] Add 360g of NMP (N-methylpyrrolidone) and DMAc (N,N-dimethylacetamide) into a 1L three-necked flask, weigh 6.50g of ODA and 16.006g of PDA, dissolve in the above polar solvent NMP and The solution was obtained in DMAc, and then the solution was cooled in a water bath, and 52.665 g of BPDA (biphenyltetracarboxylic dianhydride) was added under a nitrogen flow, the reaction temperature was controlled at 15-20 ° C, and the stirring was continued for 8 hours, and the reaction was prepared. The thermosetting polyamic acid resin glue has a solid content of 15%.

[0052] 2. Preparation of soluble thermoplastic polyimide glue

Synthetic example 2

[0054] First, prepare thermoplastic polyamic acid resin glue: add polar solvent NMP (N-methylpyrrolidone) and DMAc (N,N-dimethylacetamide) to a 1L three-necked flask, 460g in total, and weigh 8.654g of BAPS And the BAPP of 32.841g, it is dissolved in the above-mentioned polar solvent NMP and DMAc to obtain solution, this solution is cooled in water bath, adds the BPDA of 11.697g and the ODPA of 18.631g under nitrogen stream (3,3 ', 4, 4'-diphenyl ether dianhydride), the reaction temperature is controlled to be 15-20° C., and the stirring is continued for 8 hours, and the reaction is carried out to prepare a thermoplastic polyamic acid resin glue solution, wherein the solid content is 14%;

[0055] Subsequent imidization: take 40ml of acetic anhydride and 20ml of pyridine, mix them, add them to the thermoplastic polyamic acid resin glue prepared above, stir and react at room temperature for 24 hours, pour the mixture into a sufficient amount of deionized water to obtain a thermo...

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Abstract

The invention relates to the technical field of a printing circuit board and especially relates to a two-sided flexible copper clad plate. The two-sided flexible copper clad plate comprises upper and lower copper foil layers and a polyimide insulating layer clamped between the two copper foil layers. A thermoplastic polyimide glue solution is mixed with a thermoset polyamide acid resin glue solution to obtain a thermoset polyamide acid-thermoplastic polyimide mixed solution. The thermoset polyamide acid-thermoplastic polyimide mixed solution coats the surfaces of the copper foil primarily, and then the thermoset polyamide acid resin glue solution is imidized and is compounded with the other copper foil, so that the two-layer-method two-sided flexible copper clad plate is acquired. The production technique of the two-layer-method two-sided flexible copper clad plate, including steps of one coating and one pressing, is greatly simplified; the production efficiency is increased; the yield of products prepared according to the method is high; the prepared polyimide insulating layer has the comprehensive properties of high peel strength, high size stability, heat resistance, and the like.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a two-layer double-sided flexible copper-clad board. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, and digital cameras. With the continuous development of electronics industry technology, the requirements for electronic products continue to increase. More and more electronic Products tend to be thinner and more highly integrated, so the corresponding flexible copper clad laminates are required to be lighter and thinner, and at the same time, because the functions of electronic products are getting stronger and the integration is getting better and better, the resistance to flexible copper clad laminates Thermal performance, stability, and reliability all put forward higher requirements. Compared with glued sheets, two-layer flexible copper-clad laminat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/28B32B27/24B32B37/24B32B38/16B32B37/10
CPCB32B15/08B32B15/20B32B27/24B32B27/281B32B37/10B32B37/24B32B38/164B32B2037/243
Inventor 胡启彬伍宏奎茹敬宏戴周
Owner GUANGDONG SHENGYI SCI TECH