Heatproof and fireproof physicochemical plate used in CIT experiment
A technology of physical and chemical boards for laboratories, which is applied in the field of heat-resistant and fire-resistant physical and chemical boards for CIT laboratories. Water resistance, the effect of increasing the contact area
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Embodiment 1
[0023] A kind of heat-resistant and fireproof physical and chemical board for CIT laboratory proposed by the present invention comprises: physical and chemical substrate, adhesive and the physical and chemical film bonded on the physical and chemical substrate by adhesive; wherein the raw materials of physical and chemical film include by weight : 60 parts of modified phenolic resin, 16 parts of epoxy resin, 22 parts of melamine formaldehyde resin, 36 parts of lignin, 2 parts of carbon fiber, 16 parts of hollow glass microspheres, 5 parts of precipitated barium sulfate, 27 parts of white carbon black, o-phthalic acid 1.7 parts of diisooctyl dicarboxylate, 6 parts of toluene diphenyl phosphate, 2 parts of methyl methacrylate, 2 parts of styrene-acrylonitrile copolymer, 2 parts of pentaerythritol melamine diphosphate, 3 parts of guanidine sulfamate , 1.2 parts of tert-butyl hydroquinone, 6161.4 parts of anti-aging agent.
[0024] Wherein, modified phenolic resin is prepared acco...
Embodiment 2
[0029] A kind of heat-resistant and fireproof physical and chemical board for CIT laboratory proposed by the present invention comprises: physical and chemical substrate, adhesive and the physical and chemical film bonded on the physical and chemical substrate by adhesive; wherein the raw materials of physical and chemical film include by weight : 70 parts of modified phenolic resin, 10 parts of epoxy resin, 25 parts of melamine formaldehyde resin, 30 parts of lignin, 5 parts of carbon fiber, 13 parts of hollow glass microspheres, 8 parts of precipitated barium sulfate, 24 parts of white carbon black, ophthalmic 1.9 parts of diisooctyl diformate, 3 parts of toluene diphenyl phosphate, 4 parts of methyl methacrylate, 1 part of styrene-acrylonitrile copolymer, 4 parts of pentaerythritol melamine diphosphate, 2.5 parts of guanidine sulfamate , 1.5 parts of tert-butyl hydroquinone, 6161 parts of anti-aging agent.
[0030] Wherein, modified phenolic resin is prepared according to t...
Embodiment 3
[0035] A kind of heat-resistant and fireproof physical and chemical board for CIT laboratory proposed by the present invention comprises: physical and chemical substrate, adhesive and the physical and chemical film bonded on the physical and chemical substrate by adhesive; wherein the raw materials of physical and chemical film include by weight : 62 parts of modified phenolic resin, 14 parts of epoxy resin, 23 parts of melamine formaldehyde resin, 34 parts of lignin, 3 parts of carbon fiber, 15 parts of hollow glass microspheres, 6 parts of precipitated barium sulfate, 26 parts of white carbon black, o-phthalic acid 1.75 parts of diisooctyl dicarboxylate, 5 parts of toluene diphenyl phosphate, 2.5 parts of methyl methacrylate, 1.8 parts of styrene-acrylonitrile copolymer, 2.6 parts of pentaerythritol melamine diphosphate, 2.8 parts of guanidine sulfamate , 1.3 parts of tert-butyl hydroquinone, 6161.3 parts of anti-aging agent.
[0036] Wherein, modified phenolic resin is prep...
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