Thermosetting resin composition and prepreg, laminate and circuit carrier containing it
A resin composition and thermosetting technology, applied in the fields of thermosetting resin compositions, prepregs, laminates and circuit carriers, can solve the problems of affecting the quality of signal transmission, difficult to roughen the surface of the substrate, and the influence of circuit conduction, etc. Improve the activation rate and specific surface area to facilitate and enhance the effect of adhesion
Active Publication Date: 2018-01-05
江苏生益特种材料有限公司
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- Description
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- Application Information
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Problems solved by technology
Thermoplastic resins are easy to melt and coarsen after being heated, while thermosetting resins are difficult to melt after being heated due to their own characteristics. After laser irradiation, the surface of the substrate is difficult to roughen, which affects the adhesion of copper and reduces the density. This not only affects the quality of signal transmission , and it also has a certain influence on the conduction of the circuit
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0073] The composition of 100 parts of epoxy resin DER530, 3 parts of dicyandiamide, 0.05 part of 2-methylimidazole, silica and zinc molybdate (accounting for 30% of the mass fraction of the resin composition, wherein silica: molybdate Zinc=90:10 (mass ratio)), basic copper phosphate (2% of resin composition mass fraction) and hexaalkoxysilane coupling agent (SIB1817) accounting for 1% of resin composition content dissolved in organic solvent 65 wt % of glue is prepared by mechanical stirring, and then impregnated with glass fiber cloth, heated and dried to form a prepreg, and pressurized and heated to form a laminate.
Embodiment 2
[0075] The implementation of this example is the same as that of Example 1, except that the inorganic filler in Example 2 is the composition of silica and zinc molybdate, wherein silica:zinc molybdate=99:1 (mass ratio) .
Embodiment 3
[0077] The implementation of this example is the same as that of Example 1, the difference is that the inorganic filler in Example 3 is a composition of silica and zinc molybdate, wherein silica:zinc molybdate=80:20 (mass ratio) .
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Abstract
The invention provides a thermosetting resin composition as well as a prepreg, a laminated board and a circuit carrier containing the same. The thermosetting resin composition comprises thermosetting resin, a laser direct forming additive, an inorganic filler, and a silane coupling agent with 2-3 groups capable of being hydrolyzed at each of two ends of a molecular chain. The laser direct forming additive is added in the thermosetting resin composition provided by the present invention to ensure that a circuit can be formed on thermosetting resin after laser irradiation and metallization, the CTE of the composition can be reduced and the absorption of laser energy by a matrix can be enhanced by adding the inorganic filler and the silane coupling agent with 2-3 groups capable of being hydrolyzed at each of the two ends of the molecular chain, the activation rate of an LDS auxiliary agent is effectively improved, the attachment and the sedimentary thickness of the matrix to copper are obviously enhanced at the same time, and three types of components mutually cooperate with the thermosetting resin to ensure that the thermosetting resin composition has a low coefficient of thermal expansion, thereby making the prepared circuit carrier have relatively good quality of signal transmission.
Description
technical field [0001] The invention belongs to the technical field of laminates, and relates to a thermosetting resin composition and prepregs, laminates and circuit carriers containing the same. Background technique [0002] The printed circuit board (PCB) is the carrier board for the secondary packaging of electronic components and is one of the most important components in the electronics industry. The conductive circuit manufacturing of conventional PCB adopts the photolithography etching method (subtractive method), which has many disadvantages such as high material consumption, many production processes, large waste liquid discharge, and heavy environmental protection pressure. As the world's largest producer of PCB industry, my country's production process causes astonishing waste and pollution. During the 12th Five-Year Plan period and even in the future, energy conservation, emission reduction, efficiency improvement and consumption reduction are the themes of my ...
Claims
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IPC IPC(8): C08L63/00C08L79/04C08L61/06C08L71/12C08L47/00C08K13/02C08K5/315C08K5/3445C08K3/36C08K3/24C08K5/5415B32B17/04B32B27/04
CPCB32B5/26B32B2250/20B32B2260/021B32B2260/046B32B2262/101C08K3/24C08K3/36C08K5/315C08K5/3445C08K13/02C08L71/12C08L79/04C08L2203/20C08L2205/03C08L63/00C08L61/06C08L47/00C08K5/5415
Inventor 杜翠鸣邢燕侠柴颂刚
Owner 江苏生益特种材料有限公司