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Copper alloy sheet having excellent conductivity and bending deflection factor

A technology of copper alloy plate and electrical conductivity, which is applied in the direction of conductive materials, conductive materials, conductors, etc., can solve the problems that the stress relaxation characteristics of Corson alloy have not been reported, may not be sufficient, and high bending deformation coefficient, etc., to achieve high strength, Effects of high electrical conductivity and high bending deformation coefficient

Active Publication Date: 2016-04-20
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] As exemplified above, the conventional Corson alloy has high electrical conductivity and strength, but its TD bending deformation coefficient is not a grade that can meet the application of parts that flow large currents or parts that dissipate a lot of heat
In addition, conventional Corson alloys have relatively good stress relaxation properties, but the level of stress relaxation properties may not be sufficient for parts that flow large currents or parts that dissipate a lot of heat
In particular, Corson alloys with high bending deformation coefficient and excellent stress relaxation properties have not been reported so far

Method used

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  • Copper alloy sheet having excellent conductivity and bending deflection factor
  • Copper alloy sheet having excellent conductivity and bending deflection factor
  • Copper alloy sheet having excellent conductivity and bending deflection factor

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Embodiment

[0073]Examples of the present invention are shown together with comparative examples below, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

[0074] After adding alloying elements to the molten copper, it was cast into an ingot having a thickness of 200 mm. The ingot was heated at 950° C. for 3 hours, and was formed into a plate having a thickness of 15 mm by hot rolling. After grinding and removing scale on the surface of the hot-rolled plate, it is finished in the order of cold rolling, solution treatment, aging treatment, and finally cold rolling to the thickness of the product. Finally, straightening annealing is carried out.

[0075] In hot rolling, the maximum value (Rmax) and the average value (Rave) of the processing degree per pass were varied in various ways.

[0076] A continuous annealing furnace was used for the solution treatment, and the temperature in the furnac...

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Abstract

Provided are: a copper alloy sheet which exhibits a high strength, a high conductivity, a high bending deflection factor and excellent stress relaxation characteristics; and an electronic component which is suitable for large-current applications or heat dissipation applications. A copper alloy sheet characterized by: containing 0.8 to 5.0mass% of Ni and / or Co and 0.2 to 1.5mass% of Si with the balance being copper and unavoidable impurities; having a tensile strength of 500MPa or more; and exhibiting an A value of 0.5 or more as defined by the formulae, namely, A = 2X(111) + X(220) - X(200) and X(hkl) = I(hkl) / I0(hkl) [wherein I(hkl) and I0(hkl) are integrated diffraction intensities of the rolled surface and the (hkl) plane of copper powder as determined by an X-ray diffraction method].

Description

technical field [0001] The present invention relates to copper alloy plates and electronic parts for energization or heat dissipation, and particularly relates to electronic parts used as terminals, connectors, relays, switches, sockets, busbars, lead frames, heat sinks, etc. mounted on motors, electronic equipment, automobiles, etc. Copper alloy plates used as raw materials for parts, and electronic parts using the copper alloy plates. Among them, the application of high-current electronic components such as high-current connectors and terminals suitable for electric vehicles, hybrid vehicles, etc., or the application of heat-dissipating electronic components such as liquid crystal frames used in smartphones and tablet PCs Copper alloy plate and electronic parts using the copper alloy plate. Background technique [0002] There are terminals, connectors, switches, sockets, relays, busbars, lead frames, heat sinks and other parts used for electric conduction or heat conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06H01B5/02C22F1/00C22F1/08
CPCC22C9/06C22F1/08H01B1/026H05K7/20509
Inventor 波多野隆绍
Owner JX NIPPON MINING & METALS CORP
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