Electrostatic chuck and method for manufacturing electrostatic chuck

Abstract

The present invention provides an electrostatic chuck comprising: a base material; an adsorption part for adsorbing a wafer by using electrostatic force; an adhesive layer for adhering the adsorption part to the base material; and an adhesive layer anti-corrosion coating layer provided to cover an exposed surface of the adhesive layer, wherein the adhesive layer anti-corrosion coating layer has no pores or cracks since the adhesive layer anti-corrosion coating layer is made by using a method of spraying and coating, at conditions of 0-50 DEG C and a vacuum state, ceramic powder which is continuously supplied at a constant quantity so as to carry gas of which a fixed flow rate is controlled, and a method for manufacturing an electrostatic chuck, comprising the steps of: (a) forming an adhesive layer for adhering an adsorption part for adsorbing a wafer to a base material by using electrostatic force; and (b) forming an adhesive layer anti-corrosion coating layer which covers an exposed surface of the adhesive layer and has no pores or cracks by being made by using a method of spraying and coating, at conditions of 0-50 DEG C and a vacuum state, ceramic powder which is continuously supplied at a constant quantity so as to carry gas of which a fixed flow rate is controlled.

Description

technical field [0001] The invention relates to an electrostatic chuck for fixing a wafer by electrostatic force and a manufacturing method thereof in a semiconductor manufacturing process, especially to an adhesive layer for adhering an adsorption portion for fixing a wafer to a base material and an adhesive layer for preventing corrosion of the adhesive layer. Electrostatic chucks that erode coatings and methods of making the same. Background technique [0002] Electrostatic chuck is a device that absorbs and fixes wafers in semiconductor manufacturing engineering, and is used for deposition, etching, ashing, diffusion, cleaning ( cleaning) and other projects. [0003] In the plasma environment of semiconductor manufacturing engineering, on the electrostatic chuck, the adsorption part of the electrostatic chuck that directly fixes the wafer is mainly an anti-plasma (ceramicsheet) or an insulating resin sheet ( insulating resin sheet). This electrostatic chuck is an expe...

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Problems solved by technology

[0007] First, the thermal spraying method (thermal spraying) of melting and spraying the ceramic powder at a temperature above 15,000K or the cold spraying method (coldspraying) of heating and spraying the ceramic powder at a high temperature of hundreds of degrees, the adhesion of the electrostatic chuck and the ceramic sheet When spraying ceramic powder on the exposed surface of the adhesive layer formed by bonding resin, it will cause the problem of melting the adhesive layer, and it is impossible to protect the adhesive layer.

[0008] Second, considering the chemical vapor deposition (CVD; chemicalvapordeposition) method or the physical vapor deposition (PVD; Physicalvapordeposition) method, the appropriate method of the film formed by the two methods below 1 μm is placed in a plasma environment, it is difficult It is suitable for forming the exposed surface of the adhesive layer on the side of the electrostatic chuck and the protective coating, because when maintaining a thickness of more than 2 μm, it is easy to cause cracks in the coating. In addition, the adhesive layer exposed along the outer surface of the electrostatic chuck It is difficult to form a uniform coating due to the three-dimensional shape of the surface

[0009] Third, considering the aerosol spraying (AD; aerosoldeposition) method of spraying paint when the ceramic powder is in a vacuum state, the above-mentioned thermal spraying method is different from the low-temperature spraying method because it can be sprayed at room temperature. The electrostatic chuck is formed in the resin coating. The adhesive layer can be sprayed without melting, but the AD method is based on US Patent No. 7,153,567 "Composite Structure And Method And Apparatus For Forming The Same"; PCT / JPOO / 07076) Specification No. 23 of Fig.3, US Patent Register US7,993,701 "CompositeStructureFormingMethod" specification Fig.1 No. 13 and aerosol generator (aerosol generator) as the basis, on the aerosol generator equipped with powder, install a compressor, because utilize aerosol The way that the melted powder is supplied in the conveying pipe, because of the relationship between the compressor and the irregular injection of the powder, it is impossible to supply the powder sprayed in the conveying pipe in a quantitative manner, and it is impossible to control the quantitative powder, which will cause the surface to curl. Coating with three-dimensional shapes such as coils, holes, protrusions, etc., is difficult to achieve due to the thickness

[0010] In the above-mentioned AD method, in order to improve the shortcoming that the quantitative powder cannot be supplied and delivered in the aerosol generator, the description in the US Patent No. 8,241,703 "Pre-Formed ControlledParticleFormedOf FineParticlesNon-ChemicallyBondedTogether, CompositeStructureFormationMethodInvolvingControlledParticles, AndCompositeStructureFormationSystemInvolvingControlledParticle" is the same as the description in the specification Fig. .16-No. 4 aerosol generator (aerosolation mechanism) is equipped with a front-stage 2-time quantitative supply device (constantsupplymechanism), modulates the particle into the container, and supplies the particle aerosolized to the improvement method of the delivery pipe, but the above-mentioned patent specification Described in Fig.21 to Fig.30, the quantitative supply is provided in the storage container and the constant supply mechanism (constantsupplymechanism) equipped with the modified particles, and it is stated in Fig.16 in the specification that "US7, 153, 567 and US7 , 153, 567", the powder is not supplied in the aerosol generator, after all, the powder will be supplied to the conveying pipe in an irregular and non-quantitative manner, that is to say, when the AD coating device is running, the air of the device is not The sol generator and the device become a vacuum state, causing the powder to be sucked into the wheel delivery tube in an irregular manner, and it is very difficult to supply quantitatively to the delivery tube

[0011] On the other hand, the technology of U.S. Patent US2008 / 0276865 "Electrostatic Chuck, Manufacturing Method Thereof And Substrate Treating Apparatus" is a chip adsorption and fixation method, using the AD method of the mounting surface of the electrostatic chuck, and the powder of yttrium trioxide (Y203) is not sprayed to form multiple The transformation of the crystal structure is the key, but the electrostatic chuck has the bottom of the adsorption surface and the protruding surface of the contact. The problem is that the powder supplied by the delivery tube of the aerosol generator is not the same as the above-mentioned system, and it cannot be provided in a fixed way. , protruding or protruding coating film thickness around the uneven relationship between the adsorption surface of the electrostatic chuck, in fact, after the implementation of AD coating, a fixed line (line) problem occurs on the adsorption surface, the characteristics of the electrostatic chuck may cause Negative effects. In addition, the exposed surface of the electrostatic chuck for 200mm and 300mm wafer adsorption is very difficult to form an anti-erosion coating using the above-mentioned AD method. Because the above-mentioned method is implemented using the AD device system, through the aerosol generator ( aerosolgenerator; aerosolationmechanism) due to the uneven supply of powder in the delivery pipe, it is difficult to spray quantitatively. According to the coating on the above-mentioned circular exposed adhesive layer, the peeling off of the ceramic powder coating layer on the exposed surface of the adhesive layer will occur. Occurrence, the surface of the above-mentioned adhesive layer cannot form a coating film layer to prevent corrosion

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