Preparation method for electronic packaging material
An electronic packaging material and packaging material technology, which are applied in the preparation of electronic packaging materials and the field of aluminum alloy substrates, can solve problems such as manufacturing process and welding performance problems, and achieve changing machining difficulties, improving reliability and integration. The effect of considerable economic and social benefits
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[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] In terms of mass fraction, graphene oxide is 2%, SiC particles are 50%, and the balance is aluminum alloy powder, and the aluminum alloy powder contains 50% Al-40Si and 50% Al-0.2Be alloy powder. The preparation steps are as follows:
[0030] (1) 1 volume of graphene oxide and 10 volumes of ethanol are mixed and dispersed with ultrasound;
[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing device for wet mixing, mix for 10 hours, and...
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