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Electronic packaging material preparation method

An electronic packaging material, packaging material technology, applied in circuits, electrical components, electric solid devices and other directions, can solve problems such as manufacturing process and welding performance problems, and achieve the goal of changing the difficulty of machining, low production cost, and easy industrialized preparation. Effect

Inactive Publication Date: 2016-05-11
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

Method used

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  • Electronic packaging material preparation method

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In terms of mass fraction, graphene oxide is 2%, SiC particles are 50%, and the balance is aluminum alloy powder, and the aluminum alloy powder contains 50% Al-40Si and 50% Al-5Ti-B alloy powder. The preparation steps are as follows:

[0030] (1) 1 volume of graphene oxide and 10 volumes of ethanol are mixed and dispersed with ultrasound;

[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing device for wet mixing, mix for 10 hours, and...

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Abstract

The invention provides an electronic packaging material preparation method. An electronic packaging material consists of a substrate and a reinforcement part, and the substrate comprises aluminum alloy. The reinforcement part comprises, by mass, 2% of graphene oxide, 50% of SiC particles and the balance aluminum alloy powder which comprises 50% of Al-40Si and 50% of Al-5Ti-B alloy powder. By adoption of the method, the lightweight electronic packaging material with the density lower than 3.1g / cm<3> and the thermal conductivity higher than 180W / (m.K) can be obtained, and accordingly comprehensive performances of military electronic equipment can be greatly improved, and the electronic packaging material is applicable to production and preparation of ultrahigh-power module packaging materials, heat sinks of multi-chip modules, carriers of microwave tubes and military power hybrid circuits in the fields of portable devices and aerospace and other weight sensitive fields.

Description

technical field [0001] The invention relates to a method for preparing a packaging material, in particular to a method for preparing an electronic packaging material with an aluminum alloy matrix and graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C29/06C22C1/05C22C1/10C22C32/00C22C30/00H01L23/29H01L23/373
CPCC22C1/05C22C1/051C22C21/00C22C29/065C22C30/00C22C32/0005C22C32/0063H01L23/29H01L23/291H01L23/3736
Inventor 王旭东罗传彪李炯利王胜强武岳
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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