Probe clearing method of probe and probe

A technology for cleaning needles and probes, which is applied in the needle cleaning method of probes and the field of probes, which can solve problems such as test yield drop, single needle cleaning action, and excessive needle marks, so as to reduce the probability of broken needles and improve The effect of testing yield rate and improving utilization rate

Inactive Publication Date: 2016-05-18
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing probes can only achieve a single cleaning action during the needle cleaning process, for example, only a single action that is partial to grinding or partial sticking can be performed during the needle cleaning process, resulting in increased loss of the probe during the needle cleaning process. As a result, the needle marks in the functional test step are too large, too deep, or shifted
Therefore, during the functional test, engineers need to check the needle marks regularly, and if the needle marks of the probe card are too large or offset, the engineer needs to install and remove the probe card frequently, resulting in a drop in test yield

Method used

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  • Probe clearing method of probe and probe
  • Probe clearing method of probe and probe
  • Probe clearing method of probe and probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] This embodiment provides a needle cleaning method for a probe, comprising the following steps:

[0042] Polishing the surface of the probes, including the steps of inserting the probes into and lifting the probes from the adhesive clearing pads, which are made of a mixture of silicon oxide and methyl silicone into, the depth of the probe inserted into the viscous needle cleaning sheet is 50 μm, and the number of times of performing the polishing treatment step is 600 times;

[0043] Grinding the needle tip of the probe includes the step of placing the needle tip of the probe on the surface of a hard needle cleaning sheet for grinding, wherein the hard needle cleaning sheet is a silicon wafer, and the number of times of performing the grinding treatment step is 600 times.

Embodiment 2

[0045] This embodiment provides a needle cleaning method for a probe, comprising the following steps:

[0046] Polishing the surface of the probe, including the steps of inserting the probe into and lifting the probe from the adhesive clearer, which is a mixture of silicon nitride and methyl silicone made, the depth of the probe inserted into the viscous needle cleaning sheet is 70 μm, and the number of polishing steps is performed 400 times;

[0047] Grinding the needle tip of the probe includes the step of placing the needle tip of the probe on the surface of a hard needle cleaning sheet for grinding, wherein the hard needle cleaning sheet is a silicon wafer, and the number of times of performing the grinding treatment step is 400 times.

Embodiment 3

[0049] This embodiment provides a needle cleaning method for a probe, comprising the following steps:

[0050] Polishing the surface of the probe, including the steps of inserting the probe into and lifting the probe from the adhesive clearer, wherein the adhesive clearer is made of a mixture of titanium oxide and methyl silicone into, the depth of the probe inserted into the viscous needle cleaning sheet is 60 μm, and the number of times of performing the polishing treatment step is 500 times;

[0051] Grinding the needle tip of the probe includes the step of placing the needle tip of the probe on the surface of a hard needle cleaning sheet for grinding, wherein the hard needle cleaning sheet is a zirconia ceramic sheet, and the number of times of performing the grinding treatment step is 500 times .

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Abstract

The invention discloses a probe clearing method of a probe and the probe. The probe clearing method comprises the following steps of performing polishing treatment on the surface of the probe so as to clear pollutants on the surface of the probe, and cutting and activating the surface of the probe; and performing grinding treatment on a probe tip of the probe so as to passivate the probe tip of the probe. According to the probe clearing method and the probe disclosed by the invention, the surface of the probe is subjected to polishing treatment so as to clear the pollutants on the surface of the probe, and the length of the probe has no significant loss; then the probe tip of the probe is subjected to grinding treatment for passivating the probe tip of the probe, thereby reducing the condition that a test bond pad is punched caused by excessive acuteness of the probe tip, and reducing the probability that the probe is broken caused by excessive fragility of the probe tip. Therefore, after the probe is cleared by adopting the probe clearing method provided by the invention, the length of the probe tip has no significant change, further the loss of the probe in the probe clearing process is reduced, and the aim of improving the test yield of a functional test performed by adopting the probe is achieved.

Description

technical field [0001] The present application relates to the technical field of semiconductor integrated circuits, and in particular, relates to a needle cleaning method for a probe and the probe. Background technique [0002] The entire manufacturing process of semiconductor devices can be divided into wafer manufacturing, chip testing and chip packaging and other processes. Among them, wafer manufacturing refers to manufacturing semiconductor devices on a wafer, and after the semiconductor device is manufactured, a plurality of repeated chips (bare chips) will be formed on the wafer. In the chip testing step, it is necessary to perform a functional test on the chip to ensure that defective products are screened out before packaging, thereby greatly reducing chip packaging and manufacturing costs. [0003] At present, a test machine is usually used to perform functional tests on chips. The test machine includes a probe, on which a probe card is provided, and the probe ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B31/10G01R1/067
Inventor 庄宝龙詹琦隆王世荣张程
Owner SEMICON MFG INT (SHANGHAI) CORP
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