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A method for converting polycrystalline copper foil into single crystal cu(100)

A single crystal, copper substrate technology, applied in the field of materials, can solve the problems of copper foil application, reduce the conductivity and elongation of copper foil, etc., and achieve the effect of important application value

Active Publication Date: 2018-09-21
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, in the production process, defects will inevitably be introduced on the surface of copper foil. The existence of these grain boundaries and defects will greatly reduce the electrical conductivity, elongation and other properties of copper foil, which will have a significant impact on the application of copper foil

Method used

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  • A method for converting polycrystalline copper foil into single crystal cu(100)
  • A method for converting polycrystalline copper foil into single crystal cu(100)
  • A method for converting polycrystalline copper foil into single crystal cu(100)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Example 1. Simple and rapid conversion of polycrystalline copper foil surface to Cu(100) single crystal by stacking two separate copper foils

[0041] 1) Use a polishing solution composed of phosphoric acid and ethylene glycol with a mass percentage concentration of 98% in a ratio of 3:1 (v / v) to perform electrochemical polishing on the surface of the copper foil and clean the polished copper foil in sequence with deionized water (Produced by Alfa.Aesar Company, purity 98%, thickness 25 μm), cut the copper foil into two pieces of the same size and stack them up neatly, measure the distance between the two copper foils with a vernier caliper to be equal, which is 15 μm;

[0042] The two copper foils treated as above constitute a copper base;

[0043] 2) Place the stacked copper foils in a casing with a magnetic control device, then place the casing in a tube furnace, use a vacuum pump to pump the pressure of the system to about 1 Pa, and clean it with hydrogen and argon ...

Embodiment 2

[0049] Example 2. Convoluted copper foil simply and quickly converts the surface of polycrystalline copper foil into Cu(100) single crystal

[0050]1) Use a polishing solution composed of phosphoric acid and ethylene glycol with a mass percentage concentration of 98% in a ratio of 3:1 (v / v) and deionized water to sequentially clean a large-area copper foil (produced by Alfa.Aesar, purity 98 %, thickness 25 μm);

[0051] 2) Convolve the cleaned large-area copper foil into a roll, and use a vernier caliper to measure that the distance between the two copper foils is equal, which is 15 μm;

[0052] The copper foil treated as above constitutes a copper substrate;

[0053] Figure 5 (a) is a physical photo of the rolled copper foil;

[0054] 3) Put the convoluted copper foil into the casing, pump it to the lowest pressure state (about 1Pa), and clean it with hydrogen and argon for 2-3 times, under the condition of low vacuum of 1Pa and no external gas Raise the temperature of t...

Embodiment 3

[0059] Example 3: Fold the copper foil several times to convert the polycrystalline copper foil surface into Cu(100) single crystal simply and quickly

[0060] 1) Use a polishing solution composed of phosphoric acid and ethylene glycol with a mass percentage concentration of 98% in a ratio of 3:1 (v / v) and deionized water to sequentially clean a large-area copper foil (produced by Alfa.Aesar, purity 98 %, thickness 25 μm);

[0061] 2) Fold the cleaned large-area copper foil in half five times, and use a vernier caliper to measure the distance between adjacent copper foils to be 10-20 μm;

[0062] The copper foil treated as above constitutes a copper substrate;

[0063] 3) Put the convoluted copper foil into the casing, pump it to the lowest pressure state (about 1Pa), and clean it with hydrogen and argon for 2-3 times, under the condition of low vacuum of 1Pa and no external gas Raise the temperature of the tube furnace to 1020°C, the heating time is 30min, and keep for 1h f...

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Abstract

The invention discloses a method for converting polycrystal copper foil surfaces into monocrystal Cu(100). The method comprises the following steps: 1) under the condition of not introducing any gas, carrying out annealing treatment on a copper substrate, wherein the copper substrate has at least two opposite surfaces, and the distance between the two surfaces does not exceed 50 mu m; and 2) in a reducing atmosphere, carrying out reduction treatment on the copper substrate obtained in the step 1), and cooling, thereby obtaining the Cu(100) monocrystals on the opposite surfaces of the copper substrate. By adjusting the size of the copper substrate, large-area Cu(100) monocrystals with different sizes can be quickly obtained. The method has the advantages of short preparation time, simple technique and favorable compatibility with production.

Description

technical field [0001] The invention belongs to the field of materials and relates to a method for converting polycrystalline copper foil into single crystal Cu(100). Background technique [0002] Copper foil is a thin, continuous metal foil made of copper and other metals in a certain ratio, with a thickness in the micron range. Due to its excellent electrical conductivity, tensile strength, easy adhesion to the insulating layer, and low price, copper foil has a wide range of applications in the fields of pressing plates, printed circuits, lithium-ion secondary batteries, and electromagnetic shielding. At the same time, due to its high catalytic activity, high melting point, and easy etching, it has rapidly developed into one of the main substrates for chemical vapor deposition growth of emerging star materials such as graphene and boron nitride in recent years. According to different production methods, copper foil is mainly divided into rolled copper foil and electrolyti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/02C30B1/10
CPCC30B1/10C30B29/02
Inventor 彭海琳王欢刘忠范
Owner PEKING UNIV