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High-thermal-conductivity engineering plastic and preparation method thereof

A technology of engineering plastics and high thermal conductivity, applied in the fields of high thermal conductivity engineering plastics and their preparation, functional plastics and their preparation, can solve problems such as the decline of mechanical properties of plastic processing performance products, achieve excellent mechanical mechanics, and the preparation method is simple and easy Line, the effect of high thermal conductivity

Active Publication Date: 2016-06-01
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the filler content is high, the processing performance of the plastic and the mechanical properties of the product are seriously reduced

Method used

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  • High-thermal-conductivity engineering plastic and preparation method thereof
  • High-thermal-conductivity engineering plastic and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Example 1: Boron Nitride / Polycarbonate Composite

[0032] 1. Pretreatment

[0033] Put 100 parts of polycarbonate particles and 25 parts of boron nitride into a vacuum drying oven for 10 hours at 80°C;

[0034] 2. Modification of thermally conductive fillers

[0035] Put the pretreated boron nitride into a ball mill, add 200 parts of absolute ethanol, 2.5 parts of silane coupling agent KH550, 5 parts of polyvinylpyrrolidone and 7 parts of calcium stearate at the same time, ball mill for 5 hours, and then Vacuum dry for 12 hours to obtain modified boron nitride; make the modified boron nitride into a boron nitride / chloroform suspension with a concentration of 5 mg / ml, ultrasonically disperse for 10 hours, and ultrasonic power 500W;

[0036] 3. Preparation of composite materials

[0037] Mix the pretreated polycarbonate particles with the ultrasonically dispersed boron nitride / chloroform suspension, add 5 parts of ethylene bisstearamide and 5 parts of higher fatty alco...

Embodiment 2

[0038] Example 2: Boron Nitride / Polycarbonate Composite

[0039] 1. Pretreatment

[0040] Put 100 parts of polycarbonate particles and 100 parts of boron nitride into a vacuum drying oven at 80°C for 10 hours;

[0041] 2. Modification of thermally conductive fillers

[0042] Put the pretreated boron nitride into a ball mill, add 250 parts of absolute ethanol, 4 parts of silane coupling agent KH550, 6 parts of sodium lauryl sulfate and 7 parts of calcium stearate, ball mill for 6 hours, and then Vacuum dry at 80°C for 12 hours to obtain modified boron nitride; prepare the modified boron nitride into a boron nitride / chloroform suspension with a concentration of 5mg / ml, ultrasonically disperse for 15h, and ultrasonic power is 500W;

[0043] 3. Preparation of composite materials

[0044] Mix the pretreated polycarbonate particles with the ultrasonically dispersed boron nitride / chloroform suspension, add 6 parts of ethylene bis stearamide and 6 parts of higher fatty alcohol and ...

Embodiment 3

[0045] Example 3: Boron Nitride / Polycarbonate Composite

[0046] 1. Pretreatment

[0047] Put 100 parts of polycarbonate particles and 230 parts of boron nitride into a vacuum drying oven at 80°C for 10 hours;

[0048] 2. Modification of thermally conductive fillers

[0049] Put the pretreated boron nitride into a high-speed shear disperser, add 400 parts of absolute ethanol, 5 parts of silane coupling agent KH570, 6 parts of sodium lauryl sulfate and 7 parts of calcium stearate, shear Cut and disperse for 5 hours, then vacuum dry at 80°C for 15 hours to obtain modified boron nitride; prepare the modified boron nitride into a boron nitride / chloroform suspension with a concentration of 5 mg / ml, and ultrasonically disperse for 15 hours with an ultrasonic power of 500W ;

[0050] 3. Preparation of composite materials

[0051] Mix the pretreated polycarbonate particles with the ultrasonically dispersed boron nitride / chloroform suspension, add 6 parts of ethylene bisstearamide an...

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Abstract

The invention discloses high-thermal-conductivity engineering plastic and a preparation method thereof. The high-thermal-conductivity engineering plastic is prepared from raw materials as follows: in parts by mass, 100 parts of an engineering plastic matrix, 10-400 parts of thermal-conductive filler, 1-20 parts of a dispersant, 1-20 parts of a coupling agent and 5-1000 parts of other additives. The thermal-conductive filler of the engineering plastic evenly disperses in a plastic matrix solution, and is smashed after film formation and drying or spray drying to obtain granular materials. The engineering plastic prepared with the preparation method has relatively high thermal conductivity and good mechanical and machining performance.

Description

1. Technical field [0001] The invention relates to a functional plastic and a preparation method thereof, in particular to a high thermal conductivity engineering plastic and a preparation method thereof, belonging to the field of heat conduction and heat transfer materials. 2. Background technology [0002] In electronic products, the integration of electronic circuits is getting higher and higher, and the heat generated during the operation of chips is difficult to release. The accumulation of heat will affect the working stability of the device and shorten its life. Therefore, how to effectively and quickly dissipate heat from electronic devices has become a key issue. As the common substrate and carrier of electronic circuits, engineering plastics are an important barrier to prevent the release of heat to the environment. Improving the heat dissipation capacity of circuit boards is an important way to effectively improve the service life and performance of electrical a...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L81/06C08L67/00C08L71/12C08K13/06C08K9/00C08K9/06C08K9/04C08K3/38B29C43/58
CPCB29C43/58B29C2043/5808B29C2043/5816C08K3/38C08K9/00C08K9/04C08K9/06C08K9/08C08K13/06C08K2003/385C08L69/00C08L81/06
Inventor 陈鹏孙娜夏茹钱家盛苗继斌杨斌曹明苏丽芬郑争志
Owner ANHUI UNIVERSITY
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