Preparing method of electronic packaging material

Abstract

The invention provides a preparing method of an electronic packaging material. The electronic packaging material is composed of a base body and a reinforcement body; the base body comprises an aluminum alloy, and the reinforcement body comprises graphene oxide and SiC particles and comprises, by mass percentage, 2% of graphene oxide, 50% of SiC particles and the balance aluminum alloy powder; and the aluminum alloy powder comprises 70% of Al-Si, 10% of Al-Ti-B, 10% of Al-Be and 10% of Al powder. By the adoption of the method, the light electronic packaging material with the density lower than 3.1g / cm<3> and thermal conductivity larger than 180 W / (m K) can be prepared, and therefore the comprehensive performance of a military electronic device can be greatly improved; and the preparing method is suitable for producing and preparing of packaging materials of portable devices, military power hybrid circuits of aerospace and other fields sensitive to weight, carriers of microwave tubes, and heat-sink and super-power modules of a multi-chip assembly.

Description

technical field [0001] The invention relates to a method for preparing a packaging material, in particular to a method for preparing an electronic packaging material with an aluminum alloy matrix and graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, therm...

AI Technical Summary

Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

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