Method and device for manufacturing micro-interconnection bumps

Abstract

The invention discloses a micro interconnected protruding point preparing device which comprises a liquid drop spraying device and a protruding point forming device. The liquid drop spraying device comprises a cavity, a crucible, piezoelectric ceramics, a transmission rod, a heating band and the like. A central hole is formed in the bottom of the crucible, a sheet provided with a spraying hole is further connected to the bottom of the crucible, and a mechanical pump and a diffusion pump are installed on the side part of the cavity and connected with the crucible and the cavity. The micro interconnected protruding point preparing device is characterized in that the crucible is connected with the upper portion of the cavity through a three-dimensional movement controller, and cavity temperature controllers are further arranged on the two sides of the middle of the cavity; the protruding forming device comprises a base plate used for receiving liquid drops sprayed out by the liquid drop spraying device, and a base plate bearing part. The invention further discloses a method for applying the device in preparing micro interconnected protruding points. By means of the micro interconnected protruding point preparing device and the method, uniform liquid drops can be prepared, frequency is controllable, and liquid drops can be uniform in ingredient and high in dimension precision; the micro interconnected protruding point preparing device and the method have the advantages that the structure is simple, practicability is high, the preparing technological temperature is low, the base plate can be protected against burning damage or deformation, and automatic production can be achieved.

Description

technical field [0001] The invention belongs to the field of electronic manufacturing, and in particular relates to a method and a device for preparing micro-interconnection bumps in ball grid array (Ball Grid Array, BGA) packaging and chip stacking packaging technologies. Background technique [0002] Driven by Moore's Law, electronic devices continue to develop in the direction of high performance and small size, requiring electronic packaging technology to provide higher interconnection density and shorter interconnection paths. At present, ball grid array packaging and chip stack packaging have become the two most important technical solutions. In the above two technologies, the interconnection between the chip and the substrate and between the chip and the chip is mainly realized by bumps, and the interconnection bumps are usually made of Sn-based solder (such as Sn, Sn-Ag, Sn-Cu, Sn-In, Sn-Ag-Cu, etc.), pure metals (Cu, Ag, Au, etc.) or a multilayer structure composed...

AI Technical Summary

Problems solved by technology

Although this method can form particles with uniform size, shape and thermodynamic conditions, before planting balls, it is necessary to capture the droplet pattern through the camera device, analyze the droplet diameter by computer image, and then feedback the frequency of the vibrator. The debugging process is cumbersome and complicated. , and using the deflecting plate to control the falling trajectory of the charged droplet, there is a big problem in the accuracy of ball planting, and at the same time it is impossible to realize the point-by-point drop of the droplet, that is, the ejected metal jet will form multiple droplets with a very short time interval. It is difficult to achieve a fast coordinated response of the horizontal transmission table on which the substrate is placed and cannot automate production

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