A method of electroless copper deposition using pre-contact function and its application device

Abstract

A PCB electroless plating copper device comprises electroless plating copper vats, conductive bars, locating seats, a metallic titanium bar and a ballast machine; the locating seats are arranged on the electroless plating copper vats, each electroless plating copper vat is provided with two oppositely arranged locating seats, each conductive bar is erected on the two corresponding locating seats, chemical liquid is contained in the electroless plating copper vats, and the metallic titanium bar is placed in the chemical liquid and electrically connected to the ballast machine through a wire. The invention further provides an electroless plating copper adopting a pre-contact function. During the time 30-90 seconds before PCBs are put into the electroless plating copper vats, a negative contact voltage is additionally added to the chemical liquid in the electroless plating copper vats, reaction potentials between the PCBs and the chemical liquid are reduced, rapid conducting of a chemical reaction is facilitated, the stability of plating copper rate in the electroless plating copper process is improved, the thickness and backlight quality of plating copper layers are stable, the hole breakage risk is low, the production efficiency is high, the practicability is high, and strong promotion significance is achieved.

Description

technical field [0001] The invention relates to the field of PCB manufacture, in particular to an electroless copper deposition method using a pre-contact function and an application device thereof. Background technique [0002] Eletcroless Plating Copper (Eletcroless Plating Copper), also known as sinking copper or porosity (PTH), is an autocatalytic redox reaction, which is widely used in the production and processing of printed circuit boards with through holes. The process of making parts including pads, vias, solder mask layers, silk screen layers, and sinking copper. Copper sinking technology is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatments, and then thicken it through subsequent electroplating methods to make it To achieve the specific thickness of the design. [0003] At present, in the relatively common...

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Problems solved by technology

[0003] At present, in the relatively common vertical electroless copper deposition process, the chemical solution system used mainly includes the ionic activated palladium catalytic system. However, there are many deficiencies in the existing production process of the ionic activated catalytic solution system. The start is slow, and the chemical copper sinking rate fluctuates greatly with the resin area of ​​the PCB board. The smaller the resin area, the slower the copper sinking speed; and the instability of the copper sinking rate will result in poor coverage of the copper sinking layer of the PCB board, and the sinking copper hole is broken. The risk is high; on the other hand, the use of pure resin boards for co-production in the electroless copper process will result in a decrease in production efficiency

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