Radiator for laser display and preparation method of radiator

A heat dissipation device and laser display technology, which is applied in coatings, electrical components, circuits, etc., can solve the problems of the size of the heat sink and the heat dissipation performance, the small specific surface area of ​​the graphene film, and the poor adhesion and flatness of the film. Achieve enhanced thermal conductivity, reduced size, and reduced air defects

Active Publication Date: 2016-06-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for preparing a heat dissipation device for laser display. By spraying an ultra-thin composite heat conduction coating on the surface of a heat conduction substrate and heat dissipation fins, the complex preparation process and high preparation c...

Method used

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  • Radiator for laser display and preparation method of radiator
  • Radiator for laser display and preparation method of radiator
  • Radiator for laser display and preparation method of radiator

Examples

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Embodiment 1

[0033] A heat dissipation device for laser display and its preparation method, the structure of heat conduction substrate 1 and heat dissipation fins 2 is as follows figure 1 As shown, first use detergent, acetone solution, deionized water and isopropanol solution to thoroughly clean the thermally conductive substrate 1 and heat dissipation fins 2, and dry them after cleaning; spray on the thermally conductive substrate 1 and heat dissipation fins 2 The main raw material solution, the spraying rate is 5μl / s, and the spraying time is 60s. After spraying, a graphene oxide / zinc oxide composite film is formed; when the main raw material solution is not completely dry, continue spraying on the graphene oxide / zinc oxide composite film Filling material solution, the spraying rate is 2μl / s, and the spraying time is 15s. After spraying, the defects and gaps of the graphene oxide / zinc oxide composite film are filled to form a flat composite coating; the formed composite coating is subjec...

Embodiment 2

[0036] A heat dissipation device for laser display and its preparation method, the structure of heat conduction substrate 1 and heat dissipation fins 2 is as follows figure 1 As shown, first use detergent, acetone solution, deionized water and isopropanol solution to thoroughly clean the thermally conductive substrate 1 and heat dissipation fins 2, and dry them after cleaning; spray on the thermally conductive substrate 1 and heat dissipation fins 2 The main raw material solution, the spraying rate is 5μl / s, and the spraying time is 60s. After spraying, a graphene oxide / zinc oxide composite film is formed; when the main raw material solution is not completely dry, continue spraying on the graphene oxide / zinc oxide composite film Filling material solution, the spraying rate is 2μl / s, and the spraying time is 15s. After spraying, the defects and gaps of the graphene oxide / zinc oxide composite film are filled to form a flat composite coating; the formed composite coating is subjec...

Embodiment 3

[0039] A heat dissipation device for laser display and its preparation method, the structure of heat conduction substrate 1 and heat dissipation fins 2 is as follows figure 1 As shown, first use detergent, acetone solution, deionized water and isopropanol solution to thoroughly clean the thermally conductive substrate 1 and heat dissipation fins 2, and dry them after cleaning; spray on the thermally conductive substrate 1 and heat dissipation fins 2 The main raw material solution, the spraying rate is 5μl / s, and the spraying time is 60s. After spraying, a graphene oxide / zinc oxide composite film is formed; when the main raw material solution is not completely dry, continue spraying on the graphene oxide / zinc oxide composite film Filling material solution, the spraying rate is 2μl / s, and the spraying time is 15s. After spraying, the defects and gaps of the graphene oxide / zinc oxide composite film are filled to form a flat composite coating; the formed composite coating is subjec...

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PUM

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Abstract

The invention discloses a radiator for laser display and a preparation method of the radiator. The radiator comprises a heat-conducting substrate (1), radiating fins (2) and an ultra-thin composite heat-conducting coating (3), wherein the ultra-thin composite heat-conducting coating is formed by combination of reduced graphene oxide, heat-conducting silver nanoparticles, zinc oxide nanoparticles and a conductive polymer at a certain ratio. The zinc oxide nanoparticles are doped into the reduced graphene oxide; a zinc oxide-graphene composite porous structure is formed through high-temperature reaction; the specific surface area of a film is increased; the radiator has super-high heat conductivity and radiating performance; meanwhile, graphene defects in the film are filled with the doped small-size heat-conducting silver nanoparticles; and the film has a uniform heat-conducting effect; the conductive polymer is doped, so that the viscosity of a heat-conducting film raw material solution is improved; the interface compatibility of the heat-conducting film and the heat-conducting substrate is improved; the film is relatively good in flatness after being prepared; and match with a heat source is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation for electronic components with high calorific value in laser display, in particular to a heat dissipation device for laser display and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, the integration of electronic products in the field of microelectronics is getting higher and higher, and the power consumption is also increasing. Electronic components have a huge impact, which greatly restricts the performance and service life of electronic components, and has become an urgent problem to be solved. [0003] At present, in order to solve the heat dissipation requirements of various high-heat-generating electronic components, metal heat sinks or heat sinks with high thermal conductivity, such as copper and aluminum, are mostly mounted on the surface of electronic components to evenly dissipate the heat inside the electronic compone...

Claims

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Application Information

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IPC IPC(8): H01L23/373H01L23/367C09D165/00C09D125/18C09D7/12
CPCH01L23/373C08K2201/011C08L2203/20C09D7/61C09D125/18C09D165/00H01L23/3672
Inventor 于军胜郑丁蒋一鸣朱方云
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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