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Photosensitive polysiloxane component, protection film and element with the protection film

A technology of polysiloxane and composition, applied in the field of protective film and components with protective film, photosensitive polysiloxane composition, can solve the problem of poor sensitivity stability, not considering various interlayer insulating films characteristics, without considering the photosensitive characteristics of polysiloxane, etc., to achieve the effect of good sensitivity and stability

Inactive Publication Date: 2016-06-29
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although Japanese Patent Application Laid-Open No. 2003-163209 discloses various molecular weights of polysiloxane, it does not take into account the photosensitive properties of the polysiloxane; in addition to the dielectric constant, it does not take into account the molecular weight of the interlayer insulating film. various characteristics of
[0007] Under such circumstances, Japanese Patent Application Laid-Open No. 2011-123450 discloses a positive-type photosensitive polysiloxane composition, which has excellent photosensitivity, storage stability, and melt flow resistance. However, the photosensitive resin composition The sensitivity stability of the material is not good, so it cannot be accepted by the industry

Method used

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  • Photosensitive polysiloxane component, protection film and element with the protection film
  • Photosensitive polysiloxane component, protection film and element with the protection film
  • Photosensitive polysiloxane component, protection film and element with the protection film

Examples

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preparation example Construction

[0183] Method for preparing photosensitive polysiloxane composition

[0184] The photosensitive polysiloxane composition of the present invention is a positive photosensitive composition. The method that can be used to prepare the photosensitive polysiloxane composition is, for example: placing polysiloxane (A), o-naphthoquinone diazide sulfonate (B), nitrogen-containing compound (C) and solvent (D) in Stir in a stirrer to make it uniformly mixed into a solution state, and if necessary, an additive (E) can also be added, and after uniformly mixing, a photosensitive polysiloxane composition in a solution state can be obtained.

[0185] Protective film and method for forming element with protective film

[0186] The present invention also provides a protective film, which is formed by coating the above-mentioned photosensitive polysiloxane composition on an element, and then pre-baking, exposing, developing, and post-baking.

[0187] The present invention also provides an element with ...

Synthetic example A-1

[0205] In a three-necked flask with a volume of 500 ml, add 0.05 moles of 3-(triethoxysilyl)propyl succinic anhydride (hereinafter referred to as GF-20) and 0.3 moles of methyl trimethoxysilane (hereinafter referred to as MTMS), 0.65 moles of phenyltrimethoxysilane (hereinafter referred to as PTMS), and 200 grams of propylene glycol monoethyl ether (hereinafter referred to as PGEE), and add oxalic acid aqueous solution (0.40 g) within 30 minutes while stirring at room temperature Oxalic acid is dissolved in 75 grams of water). Next, the flask was immersed in an oil bath at 30°C and stirred for 30 minutes. Then, the oil bath was heated to 120°C in 30 minutes. When the temperature of the solution drops to 105°C (that is, the reaction temperature), continue heating and stirring for polymerization for 6 hours (that is, the polycondensation time). Then, the solvent and by-products are removed by distillation to obtain polysiloxane A-1. Table 1 shows the types of components of pol...

Embodiment 1

[0216] a. Preparation of photosensitive polysiloxane composition

[0217] 100 parts by weight of polysiloxane A-1, 1 part by weight of 1-[1-(4-hydroxyphenyl)isopropyl]-4-[1,1-bis(4-hydroxyphenyl)ethyl Group] benzene and o-naphthoquinone diazide-5-sulfonic acid formed o-naphthoquinone diazide sulfonate (B-1) and 0.1 parts by weight of 2-hydroxybenzimidazole (2-hydroxybenzimidazole) (C -1-1) Add 100 parts by weight of propyleneglycolmonomethyletheracetate (PGMEA) (D-1), and stir evenly with a shaking type stirrer to obtain the photosensitive material of Example 1. Sexual polysiloxane composition. The photosensitive polysiloxane composition of Example 1 was evaluated in the following evaluation method. The results are shown in Table 2.

[0218] b. Formation of protective film

[0219] Apply the photosensitive polysiloxane composition to 100×100×0.7mm by spin coating 3 On a glass substrate of a large size, a coating film with a thickness of about 2 μm is formed. Next, the coating fil...

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Abstract

The invention provides a photosensitive polysiloxane component, a protection film and an element with the protection film. The photosensitive polysiloxane component contains polysiloxane (A), an o-naphthoquinonediazidesulfonic acid ester (B), a nitrogen-containing compound (C) and a solvent (D). The nitrogen-containing compound (C) contains at least one among an imidazole derivative (C-1), a pyrazole compound (C-2), a triazole compound (C-3) and a tetrazole compound (C-4).

Description

Technical field [0001] The present invention relates to a photosensitive polysiloxane composition, a protective film, and an element with a protective film. In particular, it relates to a photosensitive polysiloxane composition, a protective film, and an element having a protective film with excellent sensitivity and stability. Background technique [0002] In recent years, with the development of the semiconductor industry, liquid crystal display (liquid crystal display, abbreviation: LCD) and organic electro-luminescence display (organic electro-luminescence display, abbreviation: OELD), the accompanying demand for size reduction has made photolithography ) Process has become a very important issue. In the photolithography process, the required pattern must be refined to achieve the goal of size reduction. Generally speaking, the miniaturized pattern is formed by exposing and developing a positive photosensitive polysiloxane composition with high resolution and high photosens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G02B1/14
Inventor 黄伟杰施俊安
Owner CHI MEI CORP