Light emitting diode epitaxial structure, growth method thereof and light emitting diode
A technology of light-emitting diodes and growth methods, applied in the field of light-emitting diode epitaxial structures and their growth methods, and light-emitting diodes, can solve the problems of difficulty in improving internal quantum efficiency, easy transition of electrons to the vicinity of dislocation lines, and high dislocation density, and achieve improved Luminous brightness, improving internal quantum efficiency, and avoiding the effect of non-radiative recombination
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Embodiment 1
[0035] 1. Buffer growth layer growth:
[0036] On the Veeco MOCVDK465I machine, patterned sapphire is used as the substrate layer, the temperature of the reaction chamber (substrate layer temperature) is controlled at 530°C, the pressure in the reaction chamber is 500 Torr, and 120L of hydrogen and 50L of ammonia are introduced into the reaction chamber. In addition, trimethylgallium was introduced at a flow rate of 60ml / min, and the rotational speed of the reaction chamber was controlled to be 600r / min. After 3min, an amorphous gallium nitride buffer growth layer with a thickness of 20nm was formed.
[0037] 2. Growth of undoped layer
[0038] Raise the temperature of the reaction chamber to 1000°C, maintain the pressure of the reaction chamber at 500 Torr, feed 120L of hydrogen and 50L of ammonia into the reaction chamber, and feed trimethylgallium at a flow rate of 200ml / min, and control the speed of the reaction chamber to 600r / min, grow for 30min, then increase the grow...
Embodiment 2
[0049] 1. Buffer growth layer growth:
[0050] On the Veeco MOCVDK465I machine, patterned sapphire is used as the substrate layer, the temperature of the reaction chamber (substrate layer temperature) is controlled at 500°C, the pressure in the reaction chamber is 550 Torr, and 100L of hydrogen and 50L of ammonia are introduced into the reaction chamber. In addition, trimethylgallium was introduced at a flow rate of 80ml / min, and the rotational speed of the reaction chamber was controlled at 600r / min. After 3min, an amorphous gallium nitride buffer growth layer with a thickness of 30nm was formed.
[0051] 2. Growth of undoped layer
[0052] Raise the temperature of the reaction chamber to 1000°C, maintain the pressure of the reaction chamber at 500 Torr, feed 80L of hydrogen and 50L of ammonia into the reaction chamber, and feed trimethylgallium at a flow rate of 150ml / min, and control the speed of the reaction chamber to 600r / min, grow for 30min, then increase the growth t...
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