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Photocured conductive adhesive and preparation method thereof

A conductive adhesive, light-curing technology, used in conductive adhesives, adhesives, adhesive types, etc., can solve the problems of high heating temperature, energy consumption, UV light can not penetrate, etc., to achieve excellent electrical conductivity, easy processing Effect

Inactive Publication Date: 2016-07-06
JIN BAOLI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although light curing technology has many advantages, the existing resin binders and conductive fillers used in conductive adhesives are mostly opaque materials. During use, UV light cannot penetrate the conductive adhesive material, making the conductive adhesive material curing incomplete.
Therefore, in the prior art, to solve the problem of incomplete curing of light-curable conductive adhesives, heating methods are often used for collaborative curing, and the heating temperature is relatively high, reaching 120-200°C, which requires additional technical investment, and components using conductive adhesives need to withstand High temperature test, but also consume more energy

Method used

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  • Photocured conductive adhesive and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: A light-cured conductive adhesive, including the following raw materials in parts by weight: 22 parts of photosensitive resin binder, 60 parts of conductive filler, 6 parts of active monomer auxiliary agent, 1.5 parts of photoinitiator, 2 parts of photocuring agent 14 parts, 14 parts of reactive diluting cross-linking agents, 5 parts of plasticizing modifiers;

[0020] The photosensitive resin binder is a difunctional aliphatic polyurethane acrylic resin and a polyether acrylic resin, and its mass ratio is 2:1; the conductive filler is nanoscale SnO 2 The mass ratio of fine powder and silver nanoparticles is 8:1.

[0021] Further, the active monomer auxiliary agent is hexafluorobutyl acrylate, methacrylamide and dipentaerythritol pentaacrylate; the photocuring agent is benzil derivatives and dialkoxyacetophenone; the Described photoinitiator is benzoin dimethyl ether (DMPA) and 2-hydroxyl-2-methyl-1-phenyl-1-propyl ketone (1173); Described reactive diluti...

Embodiment 2

[0025] Embodiment 2: A light-cured conductive adhesive, including the following raw materials in parts by weight: 15 parts of photosensitive resin binder, 40 parts of conductive filler, 3 parts of active monomer auxiliary agent, 1 part of photoinitiator, 1 part of photocuring agent 8 parts, 8 parts of active dilution crosslinking agent, 3 parts of plasticizing modifier;

[0026] The photosensitive resin binder is difunctional aliphatic polyurethane acrylic resin and polyether acrylic resin, and its mass ratio is 1:1; the conductive filler is nanoscale SnO 2 The mass ratio of fine powder and silver nanoparticles is 6:1.

[0027] Further, the active monomer auxiliary agent is methacrylamide; the photocuring agent is α-aminoalkylphenone; the photoinitiator is benzoin dimethyl ether (DMPA) and benzophenone ( BP); the reactive diluting crosslinking agent is dipropylene glycol diacrylate and trimethylol glabra triglycidyl ether, and its mass ratio is 1:1; the plasticizing modifier ...

Embodiment 3

[0029] Embodiment 3: A light-cured conductive adhesive, including the following raw materials in parts by weight: 30 parts of photosensitive resin binder, 80 parts of conductive filler, 10 parts of active monomer auxiliary agent, 2 parts of photoinitiator, 3 parts of photocuring agent 20 parts, 20 parts of reactive diluting cross-linking agents, 8 parts of plasticizing modifiers;

[0030] The photosensitive resin binder is a difunctional aliphatic polyurethane acrylic resin and a polyether acrylic resin, and its mass ratio is 3:1; the conductive filler is nanoscale SnO 2 The mass ratio of fine powder and silver nanoparticles is 10:1.

[0031] Further, the active monomer auxiliary agent is hexafluorobutyl acrylate, methacrylamide and dipentaerythritol pentaacrylate; the light curing agent is benzoylformate and benzophenone; the light The initiator is benzoin dimethyl ether (DMPA); the reactive dilution crosslinking agent is dipropylene glycol diacrylate and trimethylol glacial...

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Abstract

The invention discloses a photocured conductive adhesive which comprises the following raw materials in parts by weight: 15-30 parts of a photosensitive resin adhesive, 40-80 parts of a conductive filler, 3-10 parts of an active monomer auxiliary, 1-2 parts of a photoinitiator, 1-3 parts of a photocuring agent, 8-20 parts of active dilution cross-linking agent and 3-8 parts of a plastification modifier, wherein the photosensitive resin adhesive is bifunctional aliphatic polyurethane acrylate resin and polyether acrylate resin; and the conductive filler is nano-grade SnO2 micro powder and silver nanoparticles. The invention further discloses a preparation method of the photocured conductive adhesive. The photocured conductive adhesive disclosed by the invention can be cured without heating of high temperature and is excellent in conductive property, so that advantages of photocuring are all embodied in application of the conductive adhesive, and moreover the conductive adhesive has the advantages of time conservation, consumption reduction, easiness in processing and the like, and is very applicable to processing of electronic elements with relatively low temperature resistance capability.

Description

technical field [0001] The invention relates to the field of conductive adhesive and its preparation, in particular to a light-cured conductive adhesive and a preparation method thereof. Background technique [0002] Pb / Sn metal alloy solder used in large quantities has high strength, low melting point, good processing plasticity and low cost, and is widely used in automobiles, digital products, home appliances and other fields. However, the use of Pb / Sn metal alloy solder has potential heavy metal pollution problems. With the improvement of people's awareness of environmental protection and the restriction of environmental protection laws, green, environmentally friendly and lead-free conductive adhesive materials are gradually recognized by people. Conductive adhesive is an adhesive with certain conductivity after curing or drying. With the miniaturization and miniaturization of electronic components and the rapid development of high integration and high density of printe...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J175/14C09J171/00
CPCC08K2201/011C09J9/02C09J171/00C09J175/14C08L71/00C08K13/02C08K2003/2231C08K2003/0806C08L75/14
Inventor 李明华
Owner JIN BAOLI TECH SUZHOU