Through-hole design method of projection objective lens of lithography machine and its lens holder
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A technology of projection objective lens and design method, which is applied in the field of lithography machine, can solve the problems of affecting the quality of lithography, increasing the temperature sensitivity, and the flow dead angle in the optical path area, so as to improve the quality of lithography, reduce the sensitivity, improve the heat dissipation performance and Effect
Active Publication Date: 2018-03-02
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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However, when using this kind of projection objective lens, the internal clean inert gas only passes through the entire projection objective lens along the peripheral air holes, and does not fill the optical path, so that the optical path area forms a flow dead angle, and the internal air cannot be completely exhausted. Prone to pollution and not conducive to heat dissipation
In addition, since the optical path area is not filled with inert gas, the entire projection objective lens is more sensitive to temperature, which seriously affects the quality of photolithography.
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Embodiment 1
[0038] Embodiment 1, with θ=30, R=100, D=10, 20, 30, 40, 50, 60, 70, 80, the relationship between the total circulation distance L of each hole position and the lens spacing D is obtained as follows Figure 5 shown.
Embodiment 2
[0039] Embodiment 2, with θ=30, D=50, R=50, 70, 90, 110, 130, 150, 170, 190, the relationship between the total flow distance L of each hole position and the lens radius R is obtained as follows Figure 6 shown.
[0040] Combining Example 1 and Example 2, it can be seen that,
[0041] 1. When the lens distance D changes, the ratio of the total flow distance L of each hole hardly changes, but the radius of the lens changes, and the ratio of the total flow distance L of each hole changes, and the ratio becomes larger as the radius increases.
[0042] 2. The air hole 314 at the far end has the longest total flow distance L, so the diameter d of the air hole 314 is the largest.
[0043] Therefore, the final via 31 distribution is as Figure 7 As shown, it should be noted that in the same projection objective, the distance D between the lenses 2 is different, and the radius R of the lens holder 3 is the same. For different projection objectives, the radius R of the lens holder 3 ...
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Abstract
The invention discloses a through-hole design method for a projection objective lens of a lithography machine and a lens holder thereof. The projection objective lens of a lithography machine comprises a lens barrel, a plurality of lenses and a lens support corresponding to the lenses, and the top of the lens barrel is provided with a The air outlet and the bottom are provided with an air inlet, and one side of the lens holder is provided with several through holes, and the gas flow rate and pressure loss value of each through hole are the same, and the through holes of the adjacent lens holders are arranged diagonally. According to the illumination field of view of each lens, the present invention arranges through holes with different apertures on the corresponding lens brackets according to a specific method, and makes the through holes of adjacent lens brackets diagonally distributed, which not only ensures the air pressure inside the projection objective lens Stability, and realize the full circulation of gas inside the projection objective lens, improve the heat dissipation performance and the temperature stability of the optical path area, and at the same time, the optical path area is fully filled with inert gas, which effectively reduces the sensitivity of the projection objective lens to temperature and pressure, and improves the photolithography. quality.
Description
technical field [0001] The invention relates to the field of lithography machines, in particular to a through-hole design method for a projection objective lens of a lithography machine and a lens holder thereof. Background technique [0002] In the optical lithography of large-scale integrated circuits, the resolution of the lithography equipment determines the performance and imaging quality of the lithography machine, and the resolution of the lithography is mainly determined by the resolution of the projection objective lens. With the improvement of the integration of large-scale integrated circuit devices, the requirements for the resolution of the projection objective lens are getting higher and higher. This not only increases the structural complexity of the projection objective lens itself, but also makes its requirements on the ambient temperature and air pressure very strict. . [0003] The stability of the gas pressure inside the projection objective is very impo...
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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 张洪博赵丹丹聂宏飞龚辉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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