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A kind of preparation method of fpc board with low loss and high flexibility of high frequency transmission

A high-frequency transmission, high-flexibility technology, applied in printed circuit manufacturing, lamination of printed circuit boards, reduction of crosstalk/noise/electromagnetic interference (etc.) Reduce and other problems to achieve the effect of improving flexibility, achieving high integration, and reducing the thickness of copper layers

Active Publication Date: 2019-03-15
KUNSHAN LONGPENG PRECISION ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Coaxial cables have low loss during high-frequency transmission, but with the continuous pursuit of "light" and "thin" appearance design requirements of terminal equipment, the available space is continuously reduced, which leads to the constant increase in the diameter of coaxial cables. Reduced, and at the same time, it will increase the loss, which will run counter to the high capacity required by the system
On the other hand, the space requirements of coaxial cables are not convenient for the integrated transmission requirements of multi-antenna modules
Ordinary FPC can meet light and thin space requirements, but at present, traditional FPC cannot meet low-loss transmission requirements. With the continuous increase of frequency, transmission loss is also increasing. Difficult process to properly reduce the loss, which in turn will increase the cost

Method used

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  • A kind of preparation method of fpc board with low loss and high flexibility of high frequency transmission

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Experimental program
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Effect test

Embodiment 1

[0035] Please refer to figure 1 In this embodiment, a low-loss, high-flexibility, and high-frequency transmission FPC board 100 has a cross-sectional structure sequentially including a first solder resist layer 1, a first shielding layer 2, a first dielectric layer 3, and an adhesive layer from top to bottom. 4. Transmission line layer 5 , second dielectric layer 6 , second shielding layer 7 , and second solder resist layer 8 .

[0036] The transmission line layer 5 includes a signal line 51 formed on a central axis, and transmission areas 52 symmetrically distributed along the signal line 51 . A distance 53 is provided between the signal line 51 and the transmission area 52 .

[0037] The first solder resist layer 1 and the second solder resist layer 8 are flexible bending-resistant inks with a thickness of 12um, which are mainly used to prevent the surface of the first shield layer 2 and the second shield layer 7 made of metal from being oxidized. The surface of the first ...

Embodiment 2

[0075] The content of the second embodiment is basically the same as that of the first embodiment, the difference is that: the thickness of the first solder resist layer 1 and the second solder resist layer 8 is 18um; the thickness of the first shielding layer 2 and the second shielding layer 7 The thickness of the first dielectric layer 3 is 30um; the thickness of the bonding layer 4 is 18um; the thickness of the transmission line layer 5 is 20um; the thickness of the second dielectric layer 6 is 48um; the thickness of the reinforcing layer 10 is 1300um; The hole 21 is directly 0.15mm.

Embodiment 3

[0077] The content of the third embodiment is basically the same as that of the first embodiment, the difference is that: the thickness of the first solder resist layer 1 and the second solder resist layer 8 is 25um; the thickness of the first shielding layer 2 and the second shielding layer 7 The thickness of the first dielectric layer 3 is 50um; the thickness of the bonding layer 4 is 25um; the thickness of the transmission line layer 5 is 28um; the thickness of the second dielectric layer 6 is 75um; the thickness of the reinforcing layer 10 is 2500um; The hole 21 is directly 0.2mm.

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Abstract

The invention discloses a preparation method of a low-loss and high-flexibility high frequency transmission FPC board. The preparation method includes the following steps: S1) preparing FPC board base material, a first shielding layer and a second shielding layer; S2) obtaining a transmission line layer by performing preprocessing, film pasting, exposure, development and etching on the FPC board base material; S3) placing the transmission line layer between the first shielding layer and the second shielding layer, successively laying a bonding layer and a second dielectric layer between the first shielding layer and the transmission line layer, and laying a second dielectric layer between the second shielding layer and the transmission line layer; S4) solidifying and baking; S5) drilling holes; and S6) respectively and successively printing and forming a first solder mask and a second solder mask at the outer side of the first shielding layer and the second shielding layer to obtain an FPC board. The preparation method of a low-loss and high-flexibility high frequency transmission FPC board can manufacture an FPC board with high flexibility, low loss in high frequency transmission and high integrated level.

Description

【Technical field】 [0001] The invention belongs to the technical field of flexible circuit board manufacturing, in particular to a method for preparing an FPC board with low loss, high flexibility and high-frequency transmission. 【Background technique】 [0002] While 4G network deployment is in full swing, research on 5G has also kicked off. In 2012, the 5G research project METIS[1] supported by the European Union's 270 billion euros was officially launched. The project is divided into eight groups for scenario requirements, air interface technology, multi-antenna technology, network architecture, spectrum analysis, simulation and test platforms, etc. In-depth research; the British government has joined forces with a number of companies to create a 5G innovation center dedicated to future user needs, 5G network key performance indicators, and core technology research, evaluation and verification; South Korea is jointly promoted by the Korean Ministry of Science and Technology...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0218H05K3/0058H05K2201/0723
Inventor 曾敏毓许春雷吴芳傅彬曹明峰高德宝贾金果
Owner KUNSHAN LONGPENG PRECISION ELECTRONICS
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