Bandpass filter based on substrate integrated non-radiative dielectric waveguide

A band-pass filter and substrate integration technology, applied to waveguide devices, electrical components, circuits, etc., can solve the problems of difficult process precision and complicated steps, reduce electromagnetic interference, simplify the manufacturing process, reduce The effect of processing costs

Active Publication Date: 2016-08-10
NANJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] 1. The manufacturing process of the traditional non-radiative dielectric waveguide is complicated, and the upper and lower metal plates need to be pasted on both sides of the dielectric strip; and the height of the dielectric strip of th

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  • Bandpass filter based on substrate integrated non-radiative dielectric waveguide
  • Bandpass filter based on substrate integrated non-radiative dielectric waveguide
  • Bandpass filter based on substrate integrated non-radiative dielectric waveguide

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Embodiment Construction

[0030] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0031] The present invention provides a kind of band-pass filter circuit structure based on substrate integrated non-radiative dielectric waveguide, such as Figures 1 to 7 As shown, the transition circuit from the improved coplanar waveguide to the slot line and the substrate-integrated non-radiative dielectric waveguide are integrated on the same dielectric board; the improved transition circuit from the coplanar waveguide to the slot line is integrated in the middle layer of the entire circuit, through The triangular gradient structure connects the transition circuit from the improved coplanar waveguide to the slot line to the substrate integrated non-radiative dielectric waveguide. At the same time, when adjusting the width of the slot line at the transition circuit, the triangular gradient is also used to achieve impedance matching; the bottom ...

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Abstract

The invention discloses a bandpass filter based on a substrate integrated non-radiative dielectric waveguide. The bandpass filter is implemented through adopting a slot coupling theory on a central dielectric strip of the substrate integrated non-radiative dielectric waveguide on the basis of three layers of circuits consisting of the three-layer substrate integrated non-radiative dielectric waveguide and transition circuits from coplanar waveguides to a slot line. Since surface current at the central dielectric strip is strong, size and position of through holes are reasonably designed, and the bandpass filter with passband being 0.8GHz and good frequency selectivity can be implemented. The bandpass filter based on the substrate integrated non-radiative dielectric waveguide can be implemented smoothly, the integration of a hybrid multi-layer circuit based on microwaves and millimeter waves is realized, the design of millimeter wave band circuits and millimeter wave band devices is facilitated, the manufacturing process is simple, and the cost is low.

Description

technical field [0001] The invention relates to a band-pass filter based on a substrate integrated non-radiative dielectric waveguide, which belongs to the field of microwave technology. Background technique [0002] With the rapid development of modern wireless communication technology, spectrum resources are increasingly scarce, which makes the research and application of microwave circuits expand to millimeter wave and higher frequency bands. Non-radiative dielectric waveguides have small radiation loss and leakage loss at structural bends and discontinuities, which makes them an important component in circuit design at millimeter wave frequencies. [0003] However, the traditional non-radiative dielectric waveguide has the following two problems when it is applied to millimeter wave circuit design: [0004] 1. The manufacturing process of the traditional non-radiative dielectric waveguide is complicated, and the upper and lower metal plates need to be pasted on both sid...

Claims

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Application Information

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IPC IPC(8): H01P1/20
CPCH01P1/20
Inventor 许锋李丹丹
Owner NANJING UNIV OF POSTS & TELECOMM
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