A conductive adhesive for LED chip bonding
A technology of LED chips and conductive adhesives, applied in the field of conductive adhesives, can solve the problems of poor thermal conductivity and conductive adhesives, and achieve the effects of good electrical conductivity, high bonding strength and good heat transfer effect.
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Embodiment 1
[0036] The conductive adhesive used for LED chip bonding is made of the following components by weight: 30 parts of modified epoxy resin, 40 parts of bisphenol F epoxy resin, 15 parts of modified polyacrylic resin, epoxy Resin diluent (glycidyl methacrylate) 12 parts, silver powder 300 parts, curing agent (tert-butyl hydroquinone) 3 parts, imidazole curing accelerator 2 parts, organic solvent isopropyl acetate 30 parts, three 1 part of oxazine ultraviolet absorber, 3 parts of dispersant (sodium lauryl polyoxyethylene ether sulfate); the preparation method is to mix all components evenly and then grind them.
[0037] The preparation method of described modified epoxy resin, comprises the steps:
[0038] S11, in parts by weight, 10 parts of tung oil, 40 parts of isotridecyl alcohol, and 0.05 parts of potassium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 180 ° C, and the reaction time is 1 hour to obtain the first reactant;
[0039] S12, then add...
Embodiment 2
[0045] The conductive adhesive used for LED chip bonding is made of the following components in parts by weight: 40 parts of modified epoxy resin, 50 parts of bisphenol F epoxy resin, 20 parts of modified polyacrylic resin, epoxy Resin diluent (glycidyl methacrylate) 15 parts, silver powder 600 parts, curing agent (tert-butyl hydroquinone) 4 parts, imidazole curing accelerator 5 parts, organic solvent isopropyl acetate 40 parts, three 3 parts of oxazine ultraviolet absorber, 5 parts of dispersant (sodium lauryl polyoxyethylene ether sulfate); the preparation method is to mix all components evenly and then grind them.
[0046] The preparation method of described modified epoxy resin, comprises the steps:
[0047] S11, in parts by weight, 15 parts of tung oil, 55 parts of isotridecyl alcohol, and 0.08 parts of potassium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 220 ° C, and the reaction time is 10 hours to obtain the first reactant;
[0048] S...
Embodiment 3
[0054] The conductive adhesive used for LED chip bonding is made of the following components by weight: 35 parts of modified epoxy resin, 45 parts of bisphenol F type epoxy resin, 18 parts of modified polyacrylic resin, epoxy Resin diluent (glycidyl methacrylate) 13 parts, silver powder 500 parts, curing agent (tert-butyl hydroquinone) 3 parts, imidazole curing accelerator 3 parts, organic solvent isopropyl acetate 35 parts, three 2 parts of oxazine ultraviolet absorber, 4 parts of dispersant (sodium lauryl polyoxyethylene ether sulfate); the preparation method is to mix all the components evenly and then grind them.
[0055] The preparation method of described modified epoxy resin, comprises the steps:
[0056] S11, in parts by weight, 12 parts of tung oil, 50 parts of isotridecyl alcohol, and 0.07 parts of potassium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 200 ° C, and the reaction time is 5 hours to obtain the first reactant;
[0057] S1...
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