Novel flat plate thiele tube and preparation method thereof

Abstract

The invention proposes a new type of flat heat soaking pipe and discloses its laser preparation method, which includes an upper plate, a lower plate and liquid injection and air extraction pipes, all components are made of copper material, the lower plate of the flat heat pipe is the evaporation section, the upper plate It is the condensation section and the middle section is the heat insulation section. The inner wall of the upper and lower plates is processed with a groove structure. The groove structure is processed into a grooved composite pin-fin structure by laser according to the working principle of the heat pipe. Laser etching can be sequentially processed on the surface of the copper plate to obtain different Characteristic complex shape microstructures. The invention can improve the boiling performance of the evaporating section and the start-up performance of the heat pipe, and the steam cooling performance of the condensing section. The pin-fin structure can not only strengthen the strength of the heat pipe and reduce the interface shear force, but also facilitate the rapid reflux and dripping of the condensate on the upper plate to the lower plate. A cycle is formed to improve the heat transfer performance of the heat pipe.

Description

[0001] Technical field: The present invention relates to a heat pipe and its preparation method, specifically a flat heat soaking pipe with a grooved composite pin-fin structure and a laser preparation method. Background technique: [0002] With the rapid development of electronic technology, the high frequency and high speed of microelectronic devices, as well as the density and miniaturization of integrated circuits, make the power consumption of electronic chips increase sharply, resulting in extremely high heat flux density. The hot spot effect of integrated circuits will not only shorten the service life of electronic devices, but also affect their normal working performance. The photoelectric conversion efficiency of LED chips is only 20%-30%, and most of the energy is lost in the form of heat. How to quickly dissipate heat and reduce The small hot spot effect is an important reason restricting the development of electronic chips and integrated circuits. [0003] The fla...

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Problems solved by technology

Traditional processing methods include cutting method, electrolysis method, wire cutting method, etc. These methods have disadvantages such as non-environmental protection, damage to the strength of the pipe wall, and low processing efficiency. Laser processing has the advantages of non-contact, environmental protection, and convenience, and can process complex shapes. structure

There are certain problems in the previous grooved liquid-absorbing core. When the upper and lower plates are directly spliced, separating each channel will greatly increase the interface shear force and affect the heat transfer performance; although a frame in the middle can be spliced ​​to avoid large Interface shear force, but it will be flattened under a large vacuum; adding support columns between the upper and lower plates will increase the cumbersome process, and thickening it violates the principle of light heat pipes

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