Radiation-proof DICE memory cell applied to DVS system

Abstract

The invention discloses a radiation-proof DICE memory cell applied to a DVS system. An original DICE cell is provided with a read tube MN9, a read word line for controlling MN9 conduction, and a read bit line connected with a sensitive amplifier; above modification makes one and only one memory node be disturbed by a bit line partial pressure when the read word line starts; and disturbance to a single node automatically recovers after a disturbance source disappears by using the "binode feedback" structural characteristic of the DICE cell, and data stored in the memory cell is not affected, so the "read destroy" phenomenon is eliminated. The structure of the DICE cell becomes connection of the read bit line with one memory node from connection of the read bit line with two in-phase nodes, solves the problem of simultaneous overturning of the two in-phase nodes, induced by the bit line partial pressure when the word line starts, guarantees normal read of data, and improves the robustness of the memory cell in the subthreshold working process.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit, in particular to a storage unit structure for a static random access memory (SRAM) (Static Random Access Memory). Background technique [0002] Radiation-resistant SRAM has attracted much attention in the aerospace field and has always been a research hotspot. When low-energy α particles emitted from packaging materials and high-energy heavy ions in space are incident on integrated circuit MOS devices, energy will be deposited at sensitive nodes inside the device, and the phenomenon of "Single Event Upset (SEU)" will appear. "Upset Hardened Memory Design for Submicron CMOS Technology" published on TRANSACTIONS ONNUCLEAR SCIENCE in 1996 proposed a DICE (Dual Interlocked Storage cell) structure storage unit for deep submicron technology to reduce the occurrence of single event flipping , to reduce the soft error rate of SRAM. The DICE unit uses 4 nodes to represent a bit of binary data storag...

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Problems solved by technology

like figure 1 As shown, in the dotted line box shown in the figure, two groups of "ratio circuits" are formed by MN5 and MN1, MN6 and MN3. Assuming that the nodes X0 and X2 are at low level at this time, before the read operation starts, the bit line and the bit line The line is not precharged to a high level, and then the word line is turned on. At the moment when the word line is turned on, the voltage of X0 and X2 will suddenly rise

If the boosted voltage reaches the threshold voltage of MN2 and MN4, the positive feedback structure inside the entire unit will be triggered, resulting in data loss, which is called "read destruction".

It is because of this phenomenon that the DICE type memory cell is limited in the application field of low voltage and low power consumption.

So far, there are few studies on the stability of DICE memory cells under low voltage.

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