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Low-temperature sintering slurry for heating film and preparation method thereof

A low-temperature sintering and heating film technology, applied in the direction of heating element materials, etc., can solve the problems of good adhesion, low sintering temperature, short sintering time, etc., and achieve the effect of environmental protection of slurry, simple preparation process, and wide-range performance adjustment function.

Active Publication Date: 2019-06-07
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are various circuit paste products in the prior art; however, for the existing circuit paste products, it is difficult to have low sintering temperature, short sintering time, wide application range, energy saving and environmental protection, resistance value Low, good adhesion, good weldability comprehensive performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1, a low-temperature sintering slurry for a heating film, the weight of the nano-metal powder in the slurry is 65%, the nano-metal powder includes nano-silver powder, nano-nickel powder, nano-tin powder, and the median value of the nano-metal powder Particle size is 200nm; Among them, the weight parts of three kinds of metal powders of nano-silver powder, nano-nickel powder and nano-tin powder in the slurry are as follows:

[0028] Nano silver powder 45%

[0029] Nickel powder 5%

[0030] Tin powder 15%.

[0031] The weight portion of the low-melting glass powder in the slurry is 15%, the particle diameter of the low-melting glass powder is less than 5 μm, and the low-melting glass powder contains Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO; among them, Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO in the weight parts of slurry are as follows:

[0032] Bi 2 o 3 4%

[0033] B 2 o 3 7%

[0034] ZnO 2%

[0035] SnO 2 1%

[0036] CuO 0.5%

...

Embodiment 2

[0053] Embodiment 2, a kind of low-temperature sintering slurry for heating film, the weight portion of nano-metal powder in this slurry is 60%, and nano-metal powder comprises nano-silver powder, nano-copper powder, nano-ruthenium powder, and the median particle size of nano-metal powder Diameter is 200nm; Wherein, the weight parts of nano-silver powder, nano-copper powder, nano-ruthenium powder three kinds of metal powders in slurry are as follows:

[0054] Nano silver powder 40%

[0055] Copper powder 15%

[0056] Ruthenium powder 5%.

[0057] The weight portion of the low-melting glass powder in the slurry is 18%, the particle diameter of the low-melting glass powder is less than 5 μm, and the low-melting glass powder contains Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO; among them, Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO in the weight parts of slurry are as follows:

[0058] Bi 2 o 3 5%

[0059] B 2 o 3 8%

[0060] ZnO 2.5%

[0061] SnO2 1.5%

[00...

Embodiment 3

[0079] Embodiment 3, a low-temperature sintering slurry for a heating film, the weight of the nano-metal powder in the slurry is 60%, the nano-metal powder includes nano-silver powder, nano-nickel powder, nano-palladium powder, and the median particle size of the nano-metal powder Diameter is 200nm; Wherein, the weight parts of nano-silver powder, nano-nickel powder, nano-palladium powder three kinds of metal powders in slurry are as follows:

[0080] Nano silver powder 41%

[0081] Nickel powder 14%

[0082] Palladium Powder 7%.

[0083] The weight portion of the low-melting glass powder in the slurry is 20%, the particle size of the low-melting glass powder is less than 5 μm, and the low-melting glass powder contains Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO; among them, Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO in the weight parts of slurry are as follows:

[0084] Bi 2 o 3 6%

[0085] B 2 o 3 7.5%

[0086] ZnO 4%

[0087] SnO2 1.5%

[0088] ...

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Abstract

The invention discloses low-temperature sintering paste for a heating film and a preparation method thereof. The paste comprises a solid phase and an organic binding phase. The solid phase is composed of nanometer metal powder and low-melting-point glass powder. The organic binding phase is composed of resin, a solvent and an additive. The preparation method comprises the following technological steps that a, preparation of the low-melting-point glass powder, preparation of the organic binding phase and preparation of the paste. According to the design of the technological steps, the low-temperature sintering paste for the heating film can be effectively produced and prepared through the preparation method. By means of the material ratio and the preparation method, the prepared paste has the advantages that the low-melting-point glass powder and nanometer metal powder are combined for use, and the paste has the low temperature (lower than 450 DEG C) sintering characteristic, and can be applied to various base materials of stainless steel, ceramic, mica, polyimide films and the like by being used as a heating material; various kinds of metal powder are combined for use, the wide-range performance adjusting function is achieved for the paste; the paste is environmentally friendly, the preparation technology is simple, and energy is saved.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a low-temperature sintering slurry for a heating film and a preparation method thereof. Background technique [0002] Circuit paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents that are uniformly mixed by three-roll rolling (reminiscent of toothpaste, paint, etc.); among them, according to different uses, Circuit paste can be divided into dielectric paste, resistance paste and conductor paste: according to different substrate types, circuit paste can be divided into ceramic substrate, polymer substrate, glass substrate, metal insulating substrate circuit According to different sintering temperatures, circuit paste can be divided into high temperature, medium and low temperature drying circuit paste; according to different uses, circuit paste can be divided into general circuit paste (makin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B3/10
CPCH05B3/10
Inventor 苏冠贤蒋国辉
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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