LED-UV phototherapy glue scrubbing-free sealing layer glue and preparation method thereof
A technology of no-cleaning and sealing glue, applied in the field of material chemistry, can solve the problems of complicated nail art process, manpower, material resources and time cost increase, and achieve the effect of simple nail art process, shortened curing time, and improved convenience of use
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Embodiment 1
[0032] According to 45wt% polyurethane acrylate (Sartomer 996), 10wt% epoxy acrylate (Sartomer E151), 10wt% acryl morpholine (ACMO, Japan Xingren), 20wt% 1,6- Hexylene glycol diacrylate (HDDA, Changxing EM221), 6wt% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO, Jiuri Xincai), 8.5wt% pentaerythritol tetrakis ( 3-mercapto propionate) (PETMP Mitsui Chemicals), 0.5wt% tris (N-nitroso-N-phenylhydroxylamine) aluminum salt (510, Yingli Science and Technology) mixed feeding, under normal temperature and pressure conditions, in the mixer Stir at a speed of 1000rpm to fully dissolve the photoinitiator and fully disperse the components, then let it stand to remove air bubbles, and a clear and translucent no-scrub sealant is obtained.
Embodiment 2
[0034]According to 30wt% polyurethane acrylate (Changxing DR-U120), 20wt% polyester acrylate (Changxing 6355), 35wt% hydroxyethyl methacrylate (HEMA, Japan Mitsubishi), 5wt% 1-hydroxycyclohexyl Phenyl ketone (184, Jiuri Xincai), 3wt% of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO, Jiurixincai), 3wt% of trimethylol Propane tris(3-mercaptopropionate) (TMPMP, Jingde Chemical), 3.5wt% pentaerythritol tetrakis(3-mercaptopropionate) (PETMP Mitsui Chemicals), 0.2wt% tris(N-nitroso- N-phenylhydroxylamine) aluminum salt (510, Yingli Technology), 0.3wt% of 2,6-di-tert-butyl-4-methylphenol (BHT, Ningkang Chemical Industry) mixed feed, under normal temperature and pressure conditions, in Stir at a speed of 1200rpm in the mixer to fully dissolve the photoinitiator and fully disperse the components, then let it stand to remove air bubbles, and then obtain a clear and translucent no-scrub sealant.
Embodiment 3
[0036] According to 30wt% polyurethane acrylate (Changxing DR-U240), 15wt% epoxy acrylate (Sartomer E151), 10wt% pure acrylic resin (Changxing 6530B-4O), 10wt% acryloyl morpholine (ACMO, Japan Xingren), 20wt% hydroxyethyl methacrylate (HEMA, Mitsubishi Japan), 2wt% 1-hydroxycyclohexyl phenyl ketone (184, Jiuri Xincai), 6wt% 2,4,6 - Trimethylbenzoyl-diphenylphosphine oxide (TPO, Jiuri Xincai), 2wt% of pentaerythritol tetrakis (3-mercaptopropionate) (PETMP, Mitsui Chemicals), 4.5wt% of 1,4- Butanediol bis(3-mercaptopropionate) (BDMP, Jingde Chemical), 0.1wt% p-cresol, 0.2wt% p-aminophenol, 0.2wt% tris(2,4-di-tert-butyl Base phenol) phosphite is mixed and fed, under normal temperature and pressure conditions, stir in a mixer at a speed of 800rpm to fully dissolve the photoinitiator and fully disperse the components, and then let it stand to remove air bubbles, and a clear and translucent product is obtained. Scrub-free sealant.
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