High-weight high-strength phenol formaldehyde foam and preparation method thereof

A phenolic foam, high-strength technology, applied in the field of foam plastics, can solve the problems of limited popularization, easy slag removal, high production cost, and achieve the effects of reducing production cost, low foam density, and simple operation.

Inactive Publication Date: 2016-10-12
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, phenolic foam has the disadvantages of being brittle, easy to slag, and easy to cr

Method used

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  • High-weight high-strength phenol formaldehyde foam and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0026] Example 1

[0027] The light and high-strength phenolic foam provided in Example 1 includes the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 4 parts of silica sol, 3 parts of pH regulator, 2 parts of potassium silicate, 5 parts of emulsifier, foaming 7 parts of curing agent and 12 parts of curing agent.

[0028] The preparation method of the light and high-strength phenolic foam includes: first mixing the high-viscosity phenolic resin and silica sol uniformly, then adding a pH adjuster to make the pH=11, then adding potassium silicate, emulsifier, foaming agent and curing It is necessary to ensure that each substance is added evenly with other substances, especially when adding curing agent, increase the speed of the agitator, mix at a high stirring speed, and transfer to the mold for foaming within one minute.

[0029] The high-viscosity phenolic resin has a viscosity of 25000-35000 mPa·s.

[0030] The curing agent is a mixture of in...

Example Embodiment

[0031] Example 2

[0032] The present invention provides a light and high-strength phenolic foam, which includes the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 3 parts of pH regulator, 4 parts of silica sol, 2 parts of potassium silicate, 5 parts of emulsifier, foaming agent 7 parts, 12 parts curing agent;

[0033] The preparation method of the light high-strength phenolic foam includes: first adjusting the pH of the high-viscosity phenolic resin with a pH regulator to make the pH=11, and then adding silica sol, potassium silicate, emulsifier, foaming agent, and curing agent in sequence , Every time a substance is added, it should be ensured that it is evenly mixed with other substances, especially when adding the curing agent, the speed of the stirrer should be increased, mixed at a high stirring speed, and transferred to the mold for foaming within one minute.

[0034] The high-viscosity phenolic resin has a viscosity of 25000-35000 mPa...

Example Embodiment

[0036] Example 3

[0037] The present invention provides a light and high-strength phenolic foam, which includes the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 3 parts of pH regulator, 4 parts of silica sol, 2 parts of potassium silicate, 5 parts of emulsifier, and foaming agent 7 parts, 12 parts curing agent;

[0038] The preparation method of the light high-strength phenolic foam includes: firstly adjust the pH of the high-viscosity phenolic resin and the pH of the silica sol with a pH regulator to make the pH=11, then mix the two uniformly, and then add silicic acid in sequence Potassium, emulsifier, foaming agent, curing agent, each substance added should ensure that it is evenly mixed with other substances, especially when adding the curing agent, increase the speed of the agitator and mix at a high stirring speed. Transfer to the mold for foaming within minutes.

[0039] The high-viscosity phenolic resin has a viscosity of 25000-35...

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Abstract

The invention provides high-weight high-strength phenol formaldehyde foam and a preparation method thereof. The foam is mainly prepared from the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 4 to 6 parts of silica sol, 3 to 5 parts of pH regulators, 2 to 4 parts of potassium silicate, 7 to 10 parts of foaming agents, 5 to 10 parts of emulsifiers and 10 to 16 parts of curing agents. The preparation method of the foam has the advantages that nanometer silicon dioxide particles are introduced into formaldehyde foam by using silica sol/potassium silicate; Si-O-C chemical bonds are generated by using the effects of nanometer silicon dioxide and high-viscosity phenolic resin; an interface enhancing effect is generated. Concretely, in a container with a stirring function, the raw materials are added according to the proportion ratio; after the materials are uniformly stirred, the materials are fast poured into a mold; foaming is performed at 65 to 70 DEG C; the heat insulation is performed for 20 to 30 min; demoulding is performed. The mechanical intensity is improved; the production cost is reduced; the heat resistance is improved; the operation is simple; the method is suitable for industrialized operation.

Description

technical field [0001] The invention relates to the technical field of foam plastics, in particular to a light-weight high-strength phenolic foam and a preparation method thereof. Background technique [0002] Phenolic resin is a new generation of fireproof thermal insulation material, known as the king of thermal insulation materials, compared with inorganic thermal insulation board thermal conductivity, phenolic thermal insulation board not only has a lower thermal conductivity, but also flame retardant and easy to extinguish, smoke The advantages of small quantity, good thermal stability and light weight make it widely used in construction, transportation, chemical and other fields. However, phenolic foam has the disadvantages of being brittle, easy to drop slag, and easy to crack, and its production cost is high, which seriously limits its further popularization and use. In view of these shortcomings, the invention conducts research on strengthening and modifying the fo...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08K3/36C08K3/34C08J9/14C08G8/10
CPCC08K3/36C08G8/10C08J9/141C08J9/145C08J9/147C08J2203/14C08J2203/142C08J2203/144C08J2203/182C08J2203/202C08J2361/06C08K3/34C08K2201/011C08L2201/02C08L2201/08C08L2203/14C08L61/06
Inventor 陈艳军樊晓强张超灿黄亮
Owner WUHAN UNIV OF TECH
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