TSV electroplating method and TSV electroplating system under action of ultrasonic outfield
An ultrasonic and external field technology, applied in the direction of circuits, electrolytic components, electrolytic processes, etc., can solve the problems of inconspicuous effects of ultrasonic enhanced electroplating, and achieve the effects of reducing surface roughness, increasing diffusion speed, and promoting diffusion
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[0036] Hereinafter, the present invention will be further described in detail with reference to the drawings and specific embodiments.
[0037] The invention discloses a TSV electroplating method under the action of an ultrasonic field, such as figure 1 As shown, based on the following system, the system includes: electroplating tank 9, electroplating power supply 3, electroplating anode 8, electroplating cathode 2, ultrasonic power supply 4, transducer 5, horn and control device 1 (computer);
[0038] The electroplating tank 9 contains an electroplating solution 10 containing additives (including inhibitors, accelerators, brighteners, etc.);
[0039] The positive electrode of the electroplating power supply 3 is connected to the electroplating anode 8, and the negative electrode is connected to the electroplating cathode 2.
[0040] The ultrasonic power supply 4 is connected to the transducer 5; the transducer 5 is connected to the upper end of the horn, and the lower end of the horn ...
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