Novel method for preparing single-layer MoS2
A new method, single-layer technology, applied in the field of materials, can solve the problems of low repeatability and inability to guarantee the preparation of single-layer MoS2, and achieve the effects of improved repeatability, short preparation cycle and low cost
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[0051] Example 1.
[0052] Step (1). The SiO 2 (300nm) / Si wafer cut into 1cm 2 The square pieces serve as the substrate.
[0053] Step (2). The substrate obtained in step (1) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0054] Step (3). Use AR, 99.7% absolute ethanol solution to ultrasonically clean the substrate obtained in step (2) for 10 minutes at room temperature.
[0055] Step (4). The substrate obtained in step (3) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0056] Step (5). The substrate obtained in step (4) is ultrasonically cleaned with 30% hydrogen peroxide at room temperature for 10 minutes.
[0057] Step (6). The substrate obtained in step (5) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0058] Step (7). Dry the substrate obtained in step (6), then set the speed of the homogenizer to low speed 2000 rpm and high speed 8000 rpm, control the spin coating time ...
Example Embodiment
[0065] Example 2.
[0066] Step (1). The SiO 2 (300nm) / Si wafer cut into 1cm 2 The square pieces serve as the substrate.
[0067] Step (2). The substrate obtained in step (1) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0068] Step (3). Use AR, 99.7% absolute ethanol solution to ultrasonically clean the substrate obtained in step (2) for 10 minutes at room temperature.
[0069] Step (4). The substrate obtained in step (3) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0070] Step (5). The substrate obtained in step (4) is ultrasonically cleaned with 30% hydrogen peroxide at room temperature for 10 minutes.
[0071] Step (6). The substrate obtained in step (5) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0072] Step (7). Dry the substrate obtained in step (6), and then soak the bottom of the sink into the graphene oxide quantum dot solution, and then take out the substrate ...
Example Embodiment
[0076] Example 4.
[0077] Step (1). The SiO 2 (300nm) / Si wafer cut into 1cm 2 The square pieces serve as the substrate.
[0078] Step (2). The substrate obtained in step (1) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0079] Step (3). Use AR, 99.7% absolute ethanol solution to ultrasonically clean the substrate obtained in step (2) for 10 minutes at room temperature.
[0080] Step (4). The substrate obtained in step (3) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0081] Step (5). The substrate obtained in step (4) is ultrasonically cleaned with 30% hydrogen peroxide at room temperature for 10 minutes.
[0082] Step (6). The substrate obtained in step (5) is ultrasonically cleaned with deionized water at room temperature for 10 minutes.
[0083] Step (7). Dry the substrate obtained in step (6), and then set the speed of the homogenizer to low speed 1000 rpm and high speed 7000 rpm, control the spin coating t...
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