PCB plate-surface single-area local thickening copper plating production technology
A production process and thickening plating technology, which is used in the reinforcement of conductive patterns, secondary processing of printed circuits, electrical components, etc., can solve the problems of easy adhesion of the bunker, and achieve the effect of reducing edge effects and good bonding force.
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[0020] A production process for locally thickened copper plating on a single area of a PCB, characterized in that the process mainly includes: first cleaning the copper material, the cleaning liquid is rosin oil cleaning liquid, and the temperature during cleaning is 60°C; Micro-etching treatment, mainly using NaPS to micro-etch away 1.0um of copper on the bottom copper, the time is about 1 minute; then carry out electroless copper deposition, discharge the PCB board at an interval of 10mn, and immerse it in the chemical plating solution CuSO once 4 ·5H 2 Electroless copper deposition in O, EDTA sodium salt, potassium sodium tartrate and sodium hypophosphite; pattern electroplating after further pattern transfer; then select the anti-plating material paraffin to melt and obtain the paraffin layer of the bunker layer; then partially thicken the copper plating and use the bunker Paraffin wax layer, local thickened copper plating; then sand blasting treatment, after removing th...
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