PCB plate-surface single-area local thickening copper plating production technology

A production process and thickening plating technology, which is used in the reinforcement of conductive patterns, secondary processing of printed circuits, electrical components, etc., can solve the problems of easy adhesion of the bunker, and achieve the effect of reducing edge effects and good bonding force.

Inactive Publication Date: 2016-10-26
安徽广德威正光电科技有限公司
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  • Summary
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, when copper plating is partially thickened in a single area, the edge effect of independent pads is prone to occur. A

Method used

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Embodiment

[0020] A production process for locally thickened copper plating on a single area of ​​a PCB, characterized in that the process mainly includes: first cleaning the copper material, the cleaning liquid is rosin oil cleaning liquid, and the temperature during cleaning is 60°C; Micro-etching treatment, mainly using NaPS to micro-etch away 1.0um of copper on the bottom copper, the time is about 1 minute; then carry out electroless copper deposition, discharge the PCB board at an interval of 10mn, and immerse it in the chemical plating solution CuSO once 4 ·5H 2 Electroless copper deposition in O, EDTA sodium salt, potassium sodium tartrate and sodium hypophosphite; pattern electroplating after further pattern transfer; then select the anti-plating material paraffin to melt and obtain the paraffin layer of the bunker layer; then partially thicken the copper plating and use the bunker Paraffin wax layer, local thickened copper plating; then sand blasting treatment, after removing th...

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PUM

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Abstract

The invention provides a PCB plate-surface single-area local thickening copper plating production technology. A technological process mainly comprises the following steps of (1) cleaning a copper material, wherein a cleaning fluid is a rosin oil stain cleaning fluid; (2) carrying out microetching and using NaPS to carry out microetching on bottom copper; (3) carrying out chemical electroless plating copper and immersing the PCB into a chemical plating liquid for one time so as to carry out copper plating; (4) carrying out pattern electroplating; (5) carrying out blindage, selecting a plating resistance material to be processed and then acquiring a blindage layer; (6) locally thickening the plated copper: using the blindage layer to locally thickening the plated copper; carrying out sand blast, carrying out sand blast on a copper surface so as to acquire a frosted surface; (8) spraying tin, after a sand-blast treatment, carrying out tin spraying; (9) washing, during washing, controlling a temperature and carrying out air stirring simultaneously; and (10) after plating, using boiled water to melt a blindage layer wax layer and recycling, and then using a water-soluble cleaning agent to clean. By using the technology of the invention, edge effect generation can be effectively reduced, simultaneously uniform and smooth copper layers and tin layers can be acquired, and good conductive performance of the PCB is guaranteed.

Description

technical field [0001] The invention belongs to the field of electroplating, and in particular relates to a production process for locally thickened copper plating on a single area of ​​a PCB board surface. Background technique [0002] Printed circuit board (PCB) is one of the important parts of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . In the larger electronic product research process, the most basic success factors are the design, documentation and fabrication of the product's printed board. The design and manufacturing quality of printed boards directly affect the quality and cost of the entire product, and even lead to the success or failure of commercial competition. [...

Claims

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Application Information

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IPC IPC(8): H05K3/24
CPCH05K3/241H05K2203/0723
Inventor 袁胜巧
Owner 安徽广德威正光电科技有限公司
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