Light-cured resin material for 3D printing

A light-curing resin and 3D printing technology, applied in the direction of additive processing, etc., can solve the problems of high water absorption and damage to the stability of light-cured workpieces, and achieve the effects of low water absorption, expanded use, and reduced water absorption

Active Publication Date: 2016-11-09
HUNAN FARSOON HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a light-curable resin material to solve the disadvantages of the existing light-curable resin material that destroys the stability of the light-cured workpiece due to its high water absorption rate. The light-curable resin material of the present invention improves the use quality of the 3D printing workpiece and service life

Method used

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  • Light-cured resin material for 3D printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A photocurable resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 51%, tricyclodecane dimethanol diacrylate 2%, trimethylol propane triacrylate 5% %, Dipropylene Glycol Diacrylate 5%, Polyacrylate Elastomer Particles 5%, 3-Hydroxymethyl-1-Oxetane 7%, 2-Hydroxymethyl Oxetane 11%, Initiator 6%, trifluoroethyl acrylate 8%.

Embodiment 2

[0023] A light-curing resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 20%, alicyclic epoxy resin 30%, hydrogenated bisphenol A type epoxy resin 10%, 2 -Methyl-1,3-propanediol diacrylate 12%, trimethylolpropane trimethacrylate 8%, polyurethane elastomer particles 2%, 3-hydroxymethyl-1-oxetane 5% , initiator 8%, trifluoroethyl methacrylate 3%, pentafluoropropyl acrylate 2%.

Embodiment 3

[0025] A light-curing resin material, wherein the mass percentages of each component are: bisphenol A type E-51 epoxy resin 6%, alicyclic epoxy resin 20%, hydrogenated bisphenol A type epoxy resin 20%, two Propylene glycol diacrylate 7%, 1,6-hexanediol diacrylate 3%, silica particle modified epoxy resin 7%, polyacrylate elastomer particle 10%, 2-hydroxymethyloxetane Alkane 8%, 3-methyl-3-hydroxymethyl oxetane 15%, initiator 10%, pentafluoropropyl methacrylate 1%.

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Abstract

The invention discloses a light-cured resin material for 3D printing. The light-cured resin material for 3D printing comprises the following ingredients (by weight): 10-60% of epoxy resin, 0-30% of an acrylate monomer or acrylate prepolymer, 2-10% of an impact modifier, 5-40% of an oxetane reactive diluents, 5-20% of an initiator and 1-10% of a hydrophobic modifier. By the adoption of the light-cured resin material, water absorption after curing of the material can be reduced; problems such as volume expansion, strength reduction, modulus reduction, etc. of the material due to plasticizing effect of water molecules are effectively avoided; and use quality of workpieces is improved and service life of workpieces is prolonged.

Description

technical field [0001] The invention relates to a photocurable resin material, in particular to a photocurable resin material for 3D printing. Background technique [0002] Stereo Lithography Apparatus (SLA) was introduced by 3D System in the United States in the late 1980s. It is the most mature and widely used rapid prototyping technology today. [0003] At present, the photosensitive resin used in the photocuring process is mainly a cationic-free radical hybrid system composed of epoxy resin and acrylate monomer. Generally, in order to improve the impact resistance of the workpiece after the material is cured and formed, hydroxyl-containing components such as polyols are often added to the material components to reduce the crosslinking density and improve the toughness after curing. Raw materials are easy to absorb water; in addition, different from traditional processing methods such as injection molding, SLA technology adopts the forming method of "from points to lines...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L75/04C08L33/04C08F283/10C08F222/14C08F222/20C08F220/22C08K3/36B33Y70/00
CPCC08F283/10C08L51/08B33Y70/00C08L2205/03C08L33/04C08L75/04C08L63/00C08K3/36C08F222/103C08F222/102
Inventor 袁博佟凤宇潘强
Owner HUNAN FARSOON HIGH TECH CO LTD
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