BDADDS type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, good viscosity controllability, and comprehensive The effect of excellent performance

Inactive Publication Date: 2016-11-16
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its heat resistan

Method used

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  • BDADDS type silicon-containing epoxy imide matrix resin and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0047] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0049]1.0 g of 4,4'-bis(2,4-diaminophenoxy)diphenylsulfone (BDADDS), 20.0 g of N,N,N',N'-tetraglycidyl-1,4-bis( 4-aminophenoxy)benzene epoxy resin, 20.0 g 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin, 15.0 g CE793 epoxy resin, and 45.0 g N,N ,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane epoxy resin was put into the reaction kettle, stirred and mixed for 0.5 hours at 100℃ , add 2.0 g of BBMO-1 imide oligomer and continue to stir for 1 hour, then add 3.0 g of 3-aminopropyltrimethoxysilane and stir for 5 minutes, cool to room temperature, then add 15.0 g of 1,8-di Aza-bicyclo[5.4.0]undecene-7 and 35.0 grams of methyltetrahydrophthalic anhydride were stirred and mixed uniformly to obtain 156.0 grams of BDADDS type silicon-containing epoxyimide matrix resin, denoted as M-1.

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Abstract

The invention relates to BDADDS type silicon-containing epoxy imide matrix resin and a preparation method thereof. The BDADDS type silicon-containing epoxy imide matrix resin is prepared from 4,4'-bis(2,4-diaminophenoxy) diphenyl sulfone (BDADDS), epoxy resin, 3-aminopropyl trialkoxy silane, imide oligomer and a curing agent. The preparation method comprises the following steps: (1) preparing the imide oligomer; (2) adding the 4,4'-bis(2,4-diaminophenoxy) diphenyl sulfone and the epoxy resin in a reaction kettle, adding the imide oligomer for continuously stirring and reacting after stirring, mixing and reacting, then adding the 3-aminopropyl trialkoxy silane for stirring and reacting, and then adding the curing agent for uniformly stirring and mixing, thus obtaining the BDADDS type silicon-containing epoxy imide matrix resin. The BDADDS type silicon-containing epoxy imide matrix resin disclosed by the invention can be widely applied to adhesion between metal of steel, copper, aluminum and the like and base materials of ceramics, glass, resin-base composite and the like and preparation of fiberglass, aramid fiber and carbon fiber reinforced composite, and has a good industrial prospect.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, and in particular relates to a BDADDS silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: r...

Claims

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Application Information

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IPC IPC(8): C08G73/10
CPCC08G73/1071
Inventor 虞鑫海吴倩周志伟
Owner DONGHUA UNIV
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