Low-hardness single-component conductive glue and preparation and application methods thereof

Abstract

The invention provides low-hardness single-component conductive glue and preparation and application methods thereof. The glue is prepared from a resin composition, an organic solvent and nickel-coated graphite conductive powder; the resin composition is prepared from 20%-40% of vinyl-terminated polydimethylsiloxane, 5%-15% of hydrogen silicone bond polysiloxane oil, 0.05%-0.15% of polymerization inhibitor and 0.1%-1% of capsule coated platinum complex. The weight ratio of the resin composition to the nickel-coated graphite conductive powder is 20:40 or 80-60. The weight of the organic solvent is 20% to 40% that of the resin composition. The glue can be dispensed on a metal substrate or a shell and other components complex in structure, a cured conductive gasket has excellent elasticity, conductivity and adhesivity, good electromagnetic shielding, grounding and environment sealing efficacy is achieved, and according to the low-hardness single-component conductive glue, glue tape can be glued on the surface of a plastic or metal base material with lowest pressure in the compression process.

Description

technical field [0001] The invention relates to the field of electromagnetic shielding materials, in particular to a conductive glue and a manufacturing method thereof. Background technique [0002] Conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined by the bonding effect of the matrix resin to form a conductive adhesive. path. Since the matrix resin of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for bonding. It is mainly used to attach to the surface of the substrate, but the existing products have the following limitations: 1. Due to the Vulcanization, the hardness of the rubber strip has been strengthened, but it is not conducive to the compression operation of the product, and its elastic performance is very weak. When the rubber strip is sub...

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Problems solved by technology

Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. It is mainly used to attach to the surface of the substrate, but the existing products have the following limitations: 1. Due to the Vulcanization, the hardness of the rubber strip has been strengthened, but it is not conducive to the compression operation of the product, and its elastic performance is very weak. When the rubber strip is subjected to irregular force, it is easy to deform and break

2. The resistance is too large. Due to the uncertain factors of the external environment, under the specified production standards, the service life of the product has a certain impact

3. During the locking process of the product, when the force on the external screw increases, the resistance it receives also increases. At this time, there is a potential risk of deformation of the base material; due to the increased hardness of the rubber strip, the locking process requires frequent Check whether the material is deformed, which affects the efficiency of construction

Patent No. 200810203319.9 discloses silicone conductive adhesive, which is mainly composed of resin composition, organic solvent and silver powder. The silver powder has good electrical conductivity, but its physical properties, especially when used to coat the outer substrate It cannot effectively highlight the demand for elasticity. When the amount added is large, it is easy to cause deformation or even fracture when the force is irregular and the bending is too large.

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