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Polishing pad and manufacturing method thereof

A manufacturing method and polishing pad technology are applied in the field of porous polishing pads, which can solve problems such as uneven removal and achieve the effect of easy control.

Active Publication Date: 2018-01-02
FNS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, it may also cause uneven removal of other layers such as barrier layers

Method used

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  • Polishing pad and manufacturing method thereof

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Embodiment approach

[0033] According to one embodiment of the present invention, the hydrophilic polymer substance may be polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyvinyl acetate (PVAc), polyacrylic acid, polyethylene oxide or sulfonated iso pentadiene.

[0034] According to an embodiment of the present invention, the hydrophilic polymer substance is a polymer substance containing a hydrophilic group, and the hydrophilic group may contain an alcohol group, but is not limited thereto. The hydrophilic polymer substance containing the hydrophilic group can absorb and contain moisture, so when added to the prepolymer, it can provide moisture to the prepolymer.

[0035] According to an embodiment of the present invention, the hydrophilic polymer may be in a powder state, but is not limited thereto. As a hydrophilic polymer substance, polyvinyl alcohol (PVA), polyethylene glycol (PEG), polyvinyl acetate (PVAc), polyacrylic acid, polyethylene oxide or sulfonated isoprene are added to the p...

Embodiment 1

[0054] The prepared prepolymer was heated to 50°C to 80°C, and then powdered polyvinyl alcohol with a particle size of 10 μm to 100 μm was mixed. The function of the polyvinyl alcohol is to absorb moisture, by storing the polyvinyl alcohol powder containing about 0.01% to about 10% of moisture in an atmosphere with a humidity of about 1% to about 50% for about 1 to 48 hours , so that the water content is about 0.05% to about 10%. The mixture of the prepolymer and polyvinyl alcohol was heated in an oven at 125° C., injected into molten 4,4′-methylene-bis-(2-chloroaniline) as a curing agent, and stirred for 30 seconds. In the above stirring step, the moisture contained in the polyvinyl alcohol reacts with the isocyanate groups of the prepolymer to generate carbon dioxide in the prepolymer, thereby forming pores in the polyurethane resin. Coat the stirred resin on a plate with almost no step or a fixed mold. At this time, the plate or mold was heated in an oven at 100° C. for m...

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Abstract

The present invention relates to a porous polishing pad containing pores generated by carbon dioxide gas generated by the reaction of a prepolymer and a hydrophilic polymer substance and a method for preparing the same.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2015-0070674 filed on May 20, 2015, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a porous polishing pad containing pores generated by carbon dioxide gas generated by the reaction of a prepolymer and a hydrophilic polymer substance, and a method for producing the same. Background technique [0004] Semiconductor devices are formed into flat and thin wafers using semiconductor materials such as silicon. Wafers need to be ground to a sufficiently flat surface with no or minimal defects. To grind the wafers, various chemical, electrical and chemomechanical grinding techniques are used. Optical lenses and semiconductor wafers have been ground by chemical-mechanical means for many years. In particular, rapid development in the field of semiconductor technology ushers in v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/08C08G18/62
CPCB24B37/24
Inventor 金八坤吴承泽
Owner FNS TECH