High-temperature-resistant adhesion-resistant release film
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A release film, high temperature resistant technology, applied in the field of release film, can solve the problems of mechanical properties not meeting the needs of the industry, poor heat sealing performance of the release film, lack of release film, etc., to achieve good thermal stability and Heat shrinkage rate, easy operation, diversified functions
Inactive Publication Date: 2016-12-07
JIXIANGBAO TAICANG RELEASE MATERIAL TECH CO LTD
View PDF3 Cites 2 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0004] This kind of high temperature resistance adhesive release film is mainly used for FPC flexible circuit board lamination, but the existing release film has poor heat sealing performance, low thermal shrinkage rate, is not easy to recycle, and its mechanical properties cannot meet the needs of the industry.
[0005] In addition, the existing release films often do not have good temperature resistance, filling and separation properties, which greatly restricts their application in FPC flexible circuit boards
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0027] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:
[0030] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:
[0033] A high temperature resistant adhesive release film, including a film layer, the film layer includes the following raw materials in weight ratio:
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention provides a high-temperature-resistant adhesion-resistant release film which comprises a thin film layer. The thin film layer comprises the following raw materials in parts by weight: TPX, PP (polypropylene), ethyl 2-methacrylate, polyurethane, polyarylester, glass fibers, carbon fibers, organic montmorillonite, ethanediol, a silane coupling agent, an antioxidant, a light stabilizer, a defoaming agent and a thickener. The high-temperature-resistant adhesion-resistant release film has the advantages of smooth surface, favorable peel strength, favorable tensile strength, favorable filling property and favorable separability. The high-temperature-resistant adhesion-resistant release film has favorable temperature resistance and heat shrinkage rate, can resist photoaging, and can be used repeatedly. Besides, the high-temperature-resistant adhesion-resistant release film provided by the invention is environment-friendly and nontoxic. The synthesis method is simple, is convenient to operate and mild in conditions, and is suitable for industrial production.
Description
technical field [0001] The invention relates to a release film, in particular to a high temperature resistant adhesive release film. Background technique [0002] Release film, also known as peeling film, isolation film, separation film, barrier film, release film, film, plastic film, hole masking film, silicone oil film, silicone oil paper, anti-adhesive film, slip film, Tianna paper, release film Paper, silliconfilm, release film, release. Usually, in order to increase the release force of the plastic film, the plastic film will be treated with plasma, or coated with fluorine, or coated with silicon (silicone) release agent on the surface of the film material, such as PET, PE, OPP, etc.; It can show extremely light and stable release force for various organic pressure-sensitive adhesives (such as hot-melt adhesives, acrylic adhesives and rubber-based pressure-sensitive adhesives). [0003] Because the release film has the advantages of isolation, filling, protection, and...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more