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A Jet and Gas-Assisted Laser Drilling Method for Ceramics

A technology of gas-assisted and drilling methods, applied in laser welding equipment, manufacturing tools, welding equipment, etc., can solve problems affecting processing efficiency, processing quality and precision, reduction of gas-assisted effect, and limited thickness of ceramic workpieces, etc., to achieve The effect of lowering the temperature, reducing the thickness and improving the processing quality

Active Publication Date: 2018-07-06
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the laser processing reaches a certain depth, the auxiliary effect of the gas is significantly reduced, and the thickness of the machinable ceramic workpiece is limited, which directly affects the processing efficiency, processing quality and precision, and even makes the workpiece scrap

Method used

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  • A Jet and Gas-Assisted Laser Drilling Method for Ceramics
  • A Jet and Gas-Assisted Laser Drilling Method for Ceramics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Step 1: ultrasonically clean the ceramic workpiece 1 in alcohol for 15 minutes, and dry it in an oven;

[0030] Step 2: Fix the ceramic workpiece 1 on the three-dimensional precision machining platform, use a low-energy laser to etch the ceramic workpiece 1 in the annular etching area 2, and spray auxiliary gas coaxially to the surface of the material (the laser processing parameter is a wavelength of 1064nm, The pulse width is 100ns, the output power is 10W, the repetition frequency is 500kHz, and the defocus is 1mm; the gas is air, and the injection pressure is 20bar);

[0031] Step 3: After the processing is completed, the three-dimensional precision processing platform moves the ceramic workpiece 1 so that the center of the processing area in step 2 coincides with the center of the laser spot, and uses a high-energy laser to drill the circular drilling area 3 (the laser processing parameter is wavelength 1064nm, the pulse width is 200ns, the output power is 15W, the...

Embodiment 2

[0034] Step 1: ultrasonically clean the ceramic workpiece 1 in alcohol for 20 minutes, and dry it in an oven;

[0035] Step 2: Fix the ceramic workpiece 1 on the three-dimensional precision machining platform, use a low-energy laser to etch the ceramic workpiece 1 in the annular etching area 2, and spray auxiliary gas coaxially to the surface of the material (the laser processing parameter is a wavelength of 1064nm, The pulse width is 50ns, the output power is 15W, the repetition rate is 300kHz, the defocus is -2mm; the gas is nitrogen, and the injection pressure is 10bar);

[0036] Step 3: After the processing is completed, the three-dimensional precision processing platform moves the ceramic workpiece so that the center of the processing area in step 2 coincides with the center of the laser spot, and uses a high-energy laser to drill holes in the circular drilling area 3 (the laser processing parameter is a wavelength of 1064nm , the pulse width is 100ns, the output power is...

Embodiment 3

[0039] Step 1: ultrasonically clean the ceramic workpiece 1 in alcohol for 15 minutes, and dry it in an oven;

[0040] Step 2: Fix the ceramic workpiece 1 on the three-dimensional precision machining platform, use a low-energy laser to etch the ceramic workpiece in the ring-shaped etching area 2, and at the same time spray auxiliary gas coaxially on the surface of the material (the laser processing parameters are wavelength 1064nm, pulse The width is 100ns, the output power is 10W, the repetition frequency is 500kHz, and the defocus is 2mm; the gas is argon, and the injection pressure is 5bar);

[0041] Step 3: After the processing is completed, the three-dimensional precision processing platform moves the ceramic workpiece 1 so that the center of the processing area in step 2 coincides with the center of the laser spot, and uses a high-energy laser to drill the circular drilling area 3 (the laser processing parameter is wavelength 1064nm, the pulse width is 150ns, the output ...

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Abstract

The invention discloses a ceramic drilling method through lasers assisted with jets and gas. The method comprises the following steps that S10, a drilling area on a ceramic workpiece is determined and divided into an annular etching area and a round drilling area located in the annular etching area; S20, the lasers are used for carrying out etching machining on the annular etching area, and meanwhile auxiliary gas is jetted coaxially; and S30, after drilling machining of the annular etching area is completed, an annular jet area is formed, the lasers are used for carrying out drilling machining on the round drilling area, the auxiliary gas is jetted coaxially, meanwhile, a jet system jets liquid along the annular etching area, the jets are utilized for blocking the auxiliary gas, and the gas assistance effect is improved. When the lasers are used for carrying out drilling on the annular etching area, the auxiliary gas is jetted coaxially, the jets are used for assisting when the lasers are used for carrying out drilling on the round drilling area, and therefore slag can be washed away in time, the temperature during drilling can be reduced, then the thickness of a recasting layer is reduced, microcracks are reduced and even avoided, and the machining quality is improved.

Description

technical field [0001] The invention relates to the laser processing technology of hard and brittle materials, in particular to a ceramic drilling method of jet flow and gas-assisted laser. Background technique [0002] Laser processing has become a widely used processing method due to its characteristics of high energy, easy control, and non-contact with the workpiece to be processed. For hard and brittle materials, such as ceramics, microcracks, recast layers, and heat-affected zones produced by laser processing on the workpiece seriously affect the quality of processing. The slag generated during processing is easy to deposit on the surface to be processed, which hinders the energy absorption of the laser beam by the material and limits the thickness of the workpiece that can be processed. At present, the injection of auxiliary gas is usually used to blow away the slag and reduce the temperature of the processing area. When the laser processing reaches a certain depth, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/362B23K26/142B23K26/14
CPCB23K26/14B23K26/142B23K26/361B23K26/382B23K2103/52
Inventor 王成勇王宏建林华泰郑李娟胡小月伍尚华王启民郭伟明
Owner GUANGDONG UNIV OF TECH