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Solidifiable organic polysiloxane composition and semiconductor device

A polysiloxane and composition technology, applied in the direction of coating, etc., can solve the problems of moisture-proof performance, vulcanization resistance, and cold and thermal shock performance of LED lamp packages, and achieve high refractive index, strong hardness, and good cold resistance. The effect of thermal shock properties

Active Publication Date: 2017-01-11
GUANGZHOU HUMAN CHEM
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  • Claims
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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of poor moisture resistance, vulcanization resistance and cold and heat shock performance of the LED lamp package in the prior art, and provide a kind of LED lamp package with excellent comprehensive performance of vulcanization resistance, moisture resistance and cold and heat shock resistance. curable organopolysiloxane composition

Method used

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  • Solidifiable organic polysiloxane composition and semiconductor device
  • Solidifiable organic polysiloxane composition and semiconductor device
  • Solidifiable organic polysiloxane composition and semiconductor device

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Embodiment 1-5

[0065] Resin (A1) (A2) (A3) (B1) (B2) prepared by synthesis embodiment 1-5 and

[0066] (C) addition reaction catalyst: octanol solution of chloroplatinic acid (platinum concentration is 5wt%);

[0067] (D) Inhibitor: 2-phenyl-3-butyn-2-ol.

[0068] Mix according to the combinations shown in Table 1 (each composition is calculated in parts by weight) to obtain the composition of the present invention.

[0069] figure 1The semiconductor device LED lamp shown is packaged in the following way, providing a support 1 fixed with a light emitting element 2, wherein the light emitting element 2 is connected to the electrode 3 through a bonding wire 4 (usually a gold wire), and the above-mentioned light emitting element of the present invention The curable organopolysiloxane composition 5 is coated on the support 1 on which the light-emitting element 2 is fixed, and cured.

[0070] The physicochemical properties of the obtained compositions were evaluated by the following methods. ...

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Abstract

The invention provides a solidifiable organic polysiloxane composition with excellent comprehensive properties and a semiconductor device, in order to overcome defects of bad moisture resistance, bad sulfuration resistance as well as bad cold and thermal shock resistance properties in the prior art. The composition comprises the following components: (A1) organic polysiloxane with a straight chain molecular structure, wherein each molecule contains at least five vinyl groups which are bonded with silicon on average; (A2) organic polysiloxane with a branching molecular structure, wherein each molecule contains at least one vinyl group which is bonded with silicon on average; (A3) organic polysiloxane with a straight molecular structure, wherein each of double ends of the molecular chain is terminated by a vinyl; (B) polyorganohydridosiloxane, wherein each polyorganohydridosiloxane molecule comprises at least one hydrogen atom which is bonded to silicon on average; (C) an alkylation catalyst for silane. Compared with the prior art, the composition has good cold and thermal shock resistance properties, higher refractive index, and excellent sulfuration resistance and moisture resistance.

Description

technical field [0001] The invention relates to a silicone composition, in particular to a curable organopolysiloxane composition, and a semiconductor device formed by curing the composition. Background technique [0002] The basic structural unit of silicone polymers is composed of silicon-oxygen chains, and the side chains are connected to various other organic groups through silicon atoms. Compared with other polymer materials, organosilicon polymers have the following outstanding properties: 1. Temperature resistance, organosilicon products are based on silicon-oxygen (Si-O) bonds as the main chain structure, so the thermal stability of organosilicon products High, under high temperature (or radiation exposure) the chemical bonds of molecules will not be broken or decomposed. 2. Weather resistance, the main chain of silicone products is -Si-O-, which has better thermal stability, radiation resistance and weather resistance than other polymer materials, and has a longer ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C09D183/07C09D183/05
Inventor 陈旺郑海庭朱经纬黄光燕
Owner GUANGZHOU HUMAN CHEM
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