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High temperature resistant epoxy pouring sealant, preparation method and application thereof as packaging material in IGBT module

A technology of potting glue and high temperature resistance, which is applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc. It can solve the problems of poor high temperature resistance and the rapid development of the industry that limits the use of epoxy potting materials. , to achieve good sealing protection, low curing heat release, and simple process operation

Active Publication Date: 2017-01-11
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of IGBT towards high power, the requirements for IGBT module packaging materials are also gradually increasing. Traditional epoxy potting materials have the characteristics of poor high temperature resistance, which limits epoxy potting materials to a large extent. The use of and the rapid development of related industries

Method used

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  • High temperature resistant epoxy pouring sealant, preparation method and application thereof as packaging material in IGBT module
  • High temperature resistant epoxy pouring sealant, preparation method and application thereof as packaging material in IGBT module
  • High temperature resistant epoxy pouring sealant, preparation method and application thereof as packaging material in IGBT module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A high temperature resistant epoxy potting glue, the epoxy potting glue contains main agent A and curing agent B:

[0031] The main agent A is mainly composed of the following components in parts by mass:

[0032]

[0033] Curing agent B is mainly composed of the following components in parts by mass:

[0034]

[0035] The preparation method of the above-mentioned high temperature resistant epoxy potting glue of this embodiment includes the preparation of the main agent A and the preparation of the curing agent B;

[0036] The preparation of main agent A includes the following steps: Preheat 50 parts by mass of AG-80 epoxy resin and 30 parts by mass of TDE-85 epoxy resin at 100°C for 30 minutes, and then add 20 parts by mass of 4,4'-bis Benzene bismaleimide resin was stirred at a low speed for 30 minutes, the stirring speed was 1000r / min, the temperature was lowered to below 50°C, and then 20 parts by mass of phenyl glycidyl ether and 12 parts by mass of sea-isla...

Embodiment 2

[0045] A high temperature resistant epoxy potting glue, the epoxy potting glue contains main agent A and curing agent B:

[0046] The main agent A is mainly composed of the following components in parts by mass:

[0047]

[0048] Curing agent B is mainly composed of the following components in parts by mass:

[0049]

[0050] The preparation method of the above-mentioned high temperature resistant epoxy potting glue of this embodiment includes the preparation of the main agent A and the preparation of the curing agent B;

[0051] The preparation of main agent A includes the following steps: Preheat 60 parts by mass of AG-80 epoxy resin and 40 parts by mass of TDE-85 epoxy resin at 90°C for 30 minutes, and then add 20 parts by mass of 4,4'-di Benzene bismaleimide resin was stirred at a low speed for 30 minutes, the stirring speed was 800r / min, the temperature was lowered to below 50°C, and then 20 parts by mass of phenyl glycidyl ether and 12 parts by mass of sea-island ...

Embodiment 3

[0060] A high temperature resistant epoxy potting glue, the epoxy potting glue contains main agent A and curing agent B:

[0061] The main agent A is mainly composed of the following components in parts by mass:

[0062]

[0063] Curing agent B is mainly composed of the following components in parts by mass:

[0064]

[0065] The preparation method of the above-mentioned high temperature resistant epoxy potting glue of this embodiment includes the preparation of the main agent A and the preparation of the curing agent B;

[0066] The preparation of main agent A includes the following steps: preheat 80 parts by mass of F-76 epoxy resin and 40 parts by mass of AG-90 epoxy resin at 100°C for 30 minutes, and then add 30 parts by mass of 4,4'-di Benzene bismaleimide resin was stirred at a low speed for 30 minutes, the stirring speed was 800r / min, the temperature was lowered to below 50°C, and then 30 parts by mass of phenyl glycidyl ether and 18 parts by mass of sea-island s...

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Abstract

The invention relates to a high temperature resistant epoxy pouring sealant, a preparation method and application thereof as packaging material in an IGBT (insulated gate bipolar transistor) module. The pouring sealant comprises a main agent A and a curing agent B, the main agent A is composed of polyfunctional mixed type epoxy resin, bismaleimide resin, an active diluent, an active toughening agent, inorganic filler, and a dispersant, etc.; and the curing agent B is mainly composed of an anhydride curing agent, inorganic filler, an accelerant, and a dispersing agent, etc. The preparation method consists of: firstly preheating the polyfunctional mixed type epoxy resin, then adding bismaleimide resin and performing low-speed stirring for cooling, then adding the active diluents and other components in order, carrying out high-speed stirring dispersion, and then conducting grinding and vacuum defoamation so as to obtain the main agent A; adding the anhydride curing agent, the inorganic filler, the accelerant, and the dispersing agent into a stirring kettle in order, and carrying out grinding and defoaming treatment, thus obtaining the curing agent B. The pouring sealant can be applied as a packaging material in the IGBT module, and has the advantages of good high temperature resistance, excellent electrical properties, good fluidity and mechanical properties, etc.

Description

technical field [0001] The invention belongs to the technical field of epoxy potting glue and its preparation, and in particular relates to a high-temperature resistant epoxy potting glue and its preparation method and application. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) has the advantages of high frequency, high voltage, high current, etc. It has a wide range of uses, especially high-power IGBT, which is used in frequency control, inverter, traction drive , lighting circuits and other fields have been widely used. With the increase of my country's investment in the IGBT industry and the development of high-frequency and high-power IGBTs, the requirements for IGBT module packaging materials have gradually increased. [0003] The cured product of epoxy resin has excellent properties such as good adhesion, electrical insulation, moisture resistance and chemical resistance, and because of its good processability, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J179/08C09J11/04C09J11/06H01L23/29
Inventor 黎超华曾亮李鸿岩李忠良姜其斌
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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