Ultra-thin phase change cooling fin and production method thereof

Abstract

The invention discloses an ultra-thin phase change cooling fin and a production method thereof. The ultra-thin phase change cooling fin comprises an ultra-thin outer shell provided with a closed cavity, a liquid absorption core pasted on the inner layer of the ultra-thin outer shell and a solid-state normal temperature heat pipe working medium arranged in the closed cavity. The ultra-thin phase change cooling fin has the advantages that the ultra-thin outer shell is filled with the solid-state normal temperature heat pipe working medium, the working medium is increased in volume when phase change is produced and the cooling fin contacts a heat source, and internal pressure of the cooling fin is increased, so that the outer shell with lower rigidity is more tightly contacted with a heat source interface, contact thermal resistance between the heat source and the cooling fin is greatly reduced, heat can be more effectively transferred out from the heat source, and heat transfer power of the cooling fin is high. Overall thickness of the ultra-thin phase change cooling fin is only 0.1-0.4mm, the ultra-thin phase change cooling fin has the advantage of thin thickness, the requirement that electronic equipment is gradually light and thin can be met, and slice-like design is beneficial to uniformity of temperature of a heat transfer surface, so that heat transfer effect is better; meanwhile, a preparation technology is simple and easy to realize, and cost is low.

Description

technical field [0001] The invention belongs to the technical field of ultra-thin heat sinks and flat heat pipes, in particular to an ultra-thin phase-change heat sink and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the development trend of electronic devices is developing in the direction of high frequency, high speed and miniaturization, which will lead to a sharp increase in the heat generation of electrical devices per unit volume, which will seriously affect the stability and life of electronic chips. The heat dissipation problem of thin and light electronic products has become a bottleneck restricting the rapid development of the electronic industry. [0003] Most of the existing technologies use metal heat sinks, graphite heat sinks, and flat heat pipes. Although metal heat sinks have high thermal conductivity, their interface properties are poor, and they cannot fit well when in contact with heat so...

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Problems solved by technology

[0003] Most of the existing technologies use metal heat sinks, graphite heat sinks, and flat heat pipes. Although metal heat sinks have high thermal conductivity, their interface properties are poor, and they cannot fit well when in contact with heat sources, and there is a large thermal resistance. , can not transfer heat from the heat source to the metal heat conduction sheet well, thus affecting the overall heat dissipation performance

The graphite heat sink has a very low thermal conductivity in the vertical direction, and its interface properties are also poor, and it cannot transfer heat from the heat source well.

Although the flat heat pipe has good thermal conductivity, its manufacturing process limits its thickness, and the manufacturing cost is high, so the heat pipe cannot meet the heat dissipation requirements of electronic products that are becoming thinner and thinner

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