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a resin composition

A resin composition, styrene-butadiene resin technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve the problems of poor manufacturability, low peel strength, increased dielectric constant and dielectric loss, etc. Meet performance requirements, high peel strength, low dielectric loss

Active Publication Date: 2019-05-28
SHAANXI SHENGYI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The Chinese patent with application number CN200810142665.0 (application date: 2008.7.28, announcement number: CN101328277A, announcement date: 2010.7.21) discloses a polybutadiene modified with epoxy and maleic anhydride with a molecular weight greater than 50000 copolymer of butadiene and styrene, this patent does not give the range of epoxy modification on the molecular chain after modification, if the number of epoxy groups is too large, the polarity of the composite material will increase, The dielectric constant and dielectric loss increase; if the number of epoxy groups is too small, the peel strength between the resin system and the copper foil will be too small
In addition, the MA-modified butadiene-styrene copolymer disclosed in this patent has a molecular weight of more than 50,000, is difficult to dissolve in solvents, and has poor follow-up manufacturability

Method used

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Examples

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Embodiment

[0051] The manufacturing methods of the copper-clad laminates of Examples 1-8 and Comparative Examples 1-4: the specific parameters are shown in Table 3 and Table 4.

[0052] Dissolve styrene-butadiene resin, epoxy-modified polybutadiene, cross-linking agent, and initiator in toluene. After fully dissolving, add fillers with different particle diameters and different mass fractions, and then mix at room temperature to obtain the glue. liquid. Use glass cloth to impregnate the above glue solution, and then bake in an oven at 155°C for 5 minutes to cure to stage B to obtain a prepreg.

[0053] Next, the prepared prepreg was placed between copper foils, laminated and cured in a press at 210°C, and the dielectric constant, Tg, peel strength, DK, and Df were measured after the cured product was obtained. See Table 3 and Table 4 for specific performance.

[0054] The materials used in the foregoing examples and comparative examples are as follows:

[0055] Triallyl isocyanurate: ...

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Abstract

The invention discloses a resin composition. The resin composition comprises styrene butadiene resin, epoxy modified unsaturated polybutadiene with a molecular weight less than 50000, a crosslinking agent, and an initiator. The invention also discloses applications of the resin composition in prepreg, laminated board, copper clad laminate, and printed circuit board. The resin composition has excellent comprehensive performances such as good heatproof performance, high peeling strength, little dielectric loss, and the like, and can meet the performance requirements of high frequency sheet.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a resin composition, and also relates to the application of the resin composition in prepregs, laminates, copper-clad laminates, and printed circuit boards. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and mobile communication equipment, in order to transmit high-speed and process large-capacity information, operating signals are becoming high-frequency, and a suitable for high-frequency signal transmission is required. High-performance electrical insulating materials with special characteristics. [0003] In high-frequency circuits, the transmission loss of electrical signals is represented by the sum of dielectric loss, conductor loss, and radiation loss. The higher the frequency of electrical signals, the greater the dielectric loss, conductor loss, and radiation loss. Due to the tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L25/10C08L47/00C08K3/24B32B37/10B32B38/08
CPCB32B37/10B32B38/08C08L25/10C08L47/00C08L2201/08C08L2203/20C08L2312/00C08K3/24
Inventor 殷卫峰张记明曾耀德李莎
Owner SHAANXI SHENGYI TECH