Composite protection coating for atomic oxygen
A protective coating and composite atom technology, which is applied in the aerospace field, can solve problems such as cracks and micropores, achieve the effect of improving atomic oxygen resistance and reducing coating defects
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Embodiment 2
[0034] The spraying device used in embodiment 2 is the PVA350 precision coating device of American Asymtek company.
[0035] The TEGO450 in the embodiment is the leveling agent of the TEGO450 type produced by German Tego Company.
Embodiment 1
[0037] (1) PHPS, N, N-dimethyl glycol amine, dibutyl ether, fumed silica, TEGO450 were respectively 3wt.%, 0.05wt.%, 96.3495wt.%, 0.6wt.%, 0.0005 The content of wt.% is made into a silicon-containing solution composition.
[0038] (2) The polyimide film organic base material 1 was cleaned with alcohol, and the silicon-containing solution composition was brushed on the polyimide film organic base material 1 with a soft brush to prepare a sample.
[0039] (3) After the solvent is volatilized, the sample is transferred to a constant temperature and humidity box for curing. The temperature is 250°C, the humidity is 90%, and the curing time is 4 hours. After curing, a PHPS transition layer with a thickness of 100nm is obtained. 2 samples;
[0040] (4) The sample prepared in (3) is placed in the reaction chamber of the plasma polymerization equipment, and the reaction chamber is evacuated to 5 × 10 -3 Pa;
[0041] (5) Use the heating device of the plasma polymerization equipment ...
Embodiment 3
[0053] (1) PHPS, N, N-dimethyl glycol amine, dibutyl ether, fumed silica, TEGO450 were respectively 10wt.%, 0.06wt.%, 88.448wt.%, 1.49wt.%, 0.002 The content of wt.% is made into a silicon-containing solution composition.
[0054] (2) The polyimide film organic base material 1 is cleaned with alcohol, and the silicon-containing solution composition is coated on the polyimide film organic base material 1 to prepare a sample, and the coating method adopts scraping coating , The slit is adjusted to 2 microns when scraping.
[0055] (3) After the solvent evaporates, transfer the sample to a constant temperature and humidity chamber, and adopt the following curing procedure:
[0056] step temperature(℃) humidity(%) time (h) 1 100 90 3 2 130 80 2 3 160 70 2 4 190 60 3 5 210 50 1
[0057] After curing, a sample with a PHPS transition layer 2 with a thickness of 150 nm was prepared;
[0058] (4) The sample prepared in (3) is pl...
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