A silicone composition, a preparing method thereof and uses of the composition

A technology of organosilicon and composition, applied in the field of organosilicon composition and preparation thereof, can solve the problems such as difficulty in meeting requirements, no application of silicone rubber, etc., and achieve the effects of environmental protection, small internal stress, and good electrical properties

Active Publication Date: 2017-02-15
天津凯华绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy encapsulation coating is difficult to meet the requirements because of the natural brittleness of epoxy resin
[0007] Silicone rubber has good heat resistance, cold resistance and electrical properties, and the addition-type silicone rubber does not shrink during the curing process, does not decompose to produce by-products, and can have a safe and good appearance. However, silicone rubber is still in the field of electronic packaging. no application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0037] A silicone composition comprising the following components:

[0038] (A) 20-80 parts by weight of organopolysiloxane, wherein the molecular chain of the organopolysiloxane has at least 2 unsaturated ethylenic groups;

[0039] (B) 2 to 60 parts by weight of MQ resin, wherein the molecular chain of the MQ resin has unsaturated ethylenic groups, and the molar ratio range of M and Q units is (0.6 to 1): 1, preferably ( 0.7~0.9):1, more preferably 0.85:1;

[0040] The molar ratio of M to Q determines the size of the molecular configuration of the resin. The smaller the ratio of M, the larger the configuration of the resin, and the smaller the elasticity of the obtained silicone rubber. In order to make the obtained silicone rubber composition have greater elasticity , a ratio of M of 0.85 can have better results.

[0041] (C) 1 to 20 parts by weight of hydrogen-containing polysiloxane, wherein the hydrogen content of the hydrogen-containing polysiloxane is in the range of ...

Embodiment 1

[0101] A kind of organosilicon composition and preparation method thereof, composition and steps are as follows:

[0102] (1) 25 parts by weight of butenyl content is 5% and the MQ resin (weight average molecular weight is 4500) that M and Q unit molar ratio is 0.6 is dissolved in toluene, stirring makes MQ resin dissolve completely, adds butenyl content to be 1 50 parts by weight of butenyl silicone oil (viscosity is 4500cs), high-speed stirring and mixing at 600r / min for 30 minutes, then vacuum out the toluene at room temperature;

[0103] (2) Add 0.01 parts by weight of chloroplatinic acid and 4-(1-methylguanidino)butyl acetate of 0.20 parts by weight, and continue stirring and mixing at a high speed of 600 r / min for 30 minutes;

[0104] (3) Add 8 parts by weight of methyl hydrogen-containing silicone oil with a hydrogen content of 1% (viscosity 5000cs), stir and mix at a high speed of 600r / min for 30 minutes, use a water bath to cool down, so that the temperature during th...

Embodiment 2

[0113] A kind of organosilicon composition and preparation method thereof, composition and steps are as follows:

[0114] (1) Dissolve 25 parts by weight of MQ resin (weight average molecular weight: 6500) with a propylene group content of 5% and a molar ratio of M to Q units of 1 in toluene, stir to completely dissolve the MQ resin, and add propylene group content of 1%. 70 parts by weight of acrylic silicone oil (viscosity is 5000cs), stirred and mixed at a high speed at 600r / min for 30 minutes, then vacuumed out toluene at room temperature;

[0115] (2) Add 0.02 parts by weight of dibutyltin dilaurate and 0.7 parts by weight of 1-dimethylhydrogensiloxy-1-ethynyl-cyclohexane, and continue to stir and mix at a high speed of 600r / min for 30 minutes;

[0116] (3) Add 10 parts by weight of ethyl hydrogen-containing silicone oil with a hydrogen content of 1.2% (viscosity is 4500cs), stir and mix at a high speed of 600r / min for 30 minutes, use a water bath to cool down, so that th...

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Abstract

A silicone composition is disclosed. The composition includes 20-80 parts by weight of organic silicone, 2-60 parts by weight of MQ resin, 1-20 parts by weight of hydrogen-containing silicone and an effective amount of a hydrosilylation catalyst and a hydrosilylation inhibitor. The invention also discloses a preparing method of the silicone composition, a method of using the silicone composition for encapsulating electronic elements such as pressure-sensitive resistors, ceramic capacitors and thermistors, and a method of using the silicone composition for embedding electronic elements such as capacitors. The composition has a long active period, and can be stably stored for long term at 100 DEG C or below. The composition after encapsulating and embedding the electronic elements has excellent flexibility and resistance to cold and hot alternation, and has good moisture resistance and resistance to large-current impact.

Description

technical field [0001] The present invention relates to a kind of organosilicon composition and its preparation method, and relates to the method that said organosilicon composition is used for encapsulating electronic components such as piezoresistors, ceramic capacitors, thermistors, and the method of encapsulating electronic components such as capacitors method, especially a silicone composition and its preparation method and use. Background technique [0002] With the development of science and technology, the application of electronic appliances is more and more extensive, but its application environment is complex, especially electronic appliances tend to be integrated, miniaturized, and modularized, so higher requirements are put forward for the stability of their use. Factors affecting the stability of electronic appliances mainly include moisture, dust pollution, intrusion of corrosive substances, mechanical vibration, external force damage and so on. Therefore, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/00C08K3/36C08K3/40C08K3/22C08K3/34C08K5/5435H01L23/29
CPCC08K2201/006C08K2201/014C08L83/04C08L2201/02C08L2203/206C08L2205/025C08L2205/03C08L2205/05C08L2312/00H01L23/296C08K13/02C08K3/00C08K3/36C08K3/40C08K2003/2227C08K3/34C08K5/5435
Inventor 孙登海王典杰任志成
Owner 天津凯华绝缘材料股份有限公司
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