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Copper colloid catalyst solution for electroless copper plating and electroless copper plating method

An electroless copper plating and catalyst technology, applied in the direction of physical/chemical process catalysts, chemical instruments and methods, catalyst activation/preparation, etc., can solve problems such as coating defects, coating streaks, coatings, etc., to increase productivity, improve effects, reduce cost effect

Active Publication Date: 2017-02-15
ISHIHARA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The basic principle of the above-mentioned water-based catalyst solution is to treat a soluble metal salt with a reducing agent to generate fine metal particles, but in fact, including the catalyst solutions of the above-mentioned Patent Documents 1 to 5, most of the catalyst solutions based on this principle generally have time-dependent stability. Problem, it is not easy to maintain the continuity of catalyst imparting and electroless plating operation smoothly for a long time
[0011] If the stability over time is lowered, even if electroless copper plating is carried out by catalyst application, a film may appear, or there may be problems such as defects in the plating film where no film is deposited locally, streaks in the plating film, or poor uniformity.

Method used

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  • Copper colloid catalyst solution for electroless copper plating and electroless copper plating method
  • Copper colloid catalyst solution for electroless copper plating and electroless copper plating method

Examples

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Embodiment 1

[0147] Embodiment 1 is to use citric acid as colloid stabilizer in catalyst liquid, use xylitol (sugar alcohol) as carbohydrate, use sodium borohydride and hypophosphorous acid as the example of reducing agent. Example 2 is an example in which the content of xylitol is adjusted to the lower limit of the above-mentioned normal range based on Example 1, and Example 3 is an example in which the content of xylitol is adjusted to the upper limit of the above-mentioned normal range. Embodiment 4 is the example that carbohydrate uses sorbitol (sugar alcohol), similarly embodiment 5 is the example that carbohydrate uses mannitol (sugar alcohol), and embodiment 6 is the example that carbohydrate uses gluconolactone (monosaccharide) derivatives), Example 7 is an example of carbohydrates using glucose (monosaccharides), and Example 8 is an example of carbohydrates using maltose (disaccharides). Embodiment 9 is an example in which carbohydrates use xylitol, and synthetic water-soluble pol...

Embodiment 2

[0184] Based on the above-mentioned Example 1, the copper colloidal catalyst solution is prepared according to the following composition. In addition, the liquid containing the adsorption accelerator, the composition of the electroless copper plating solution, and the processes of adsorption promotion, catalyst imparting, and electroless copper plating The conditions are the same as in Example 1.

[0185] (b) Preparation of Copper Colloidal Catalyst Liquid

[0186] [copper solution]

[0187] Copper sulfate (as Cu 2+ Count): 0.1 mol / L

[0188] Citric acid: 0.2 mol / L

[0189] Xylitol: 0.001 mol / L

[0190] [reducing agent solution]

[0191] Sodium borohydride: 0.02 mol / L

[0192] Hypophosphorous acid: 0.18 mol / L

[0193] The reducing agent solution was added dropwise to the 25° C. copper solution adjusted to pH 4.0 and stirred for 45 minutes to prepare a copper colloidal catalyst solution.

[0194] The molar ratios of the respective components of the catalyst liquid are as ...

Embodiment 3

[0198] Based on the above-mentioned Example 1, the copper colloidal catalyst solution is prepared according to the following composition. In addition, the liquid containing the adsorption accelerator, the composition of the electroless copper plating solution, and the processes of adsorption promotion, catalyst imparting, and electroless copper plating The conditions are the same as in Example 1.

[0199] (b) Preparation of Copper Colloidal Catalyst Liquid

[0200] [copper solution]

[0201] Copper sulfate (as Cu 2+ Count): 0.1 mol / L

[0202] Citric acid: 0.2 mol / L

[0203] Xylitol: 4.0 mol / L

[0204] [reducing agent solution]

[0205] Sodium borohydride: 0.02 mol / L

[0206] Hypophosphorous acid: 0.18 mol / L

[0207] The reducing agent solution was added dropwise to the 25° C. copper solution adjusted to pH 4.0 and stirred for 45 minutes to prepare a copper colloidal catalyst solution.

[0208] The molar ratios of the respective components of the catalyst liquid are as ...

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Abstract

The stability of a catalyst solution over time is notably improved by performing a preliminary adhesion-promoting treatment of soaking a non-electrically conductive substrate in a surfactant-containing solution and then applying a catalyst on the non-electrically conductive substrate with a copper colloid catalyst solution for electroless copper plating that contains (A) a soluble copper salt, (B) a reducing agent, (C) a colloid stabilizer, and (D) a specific sugar such as glucose, maltose, xylitol, sorbitol, etc. and performing electroless copper plating. Moreover, since the catalyst is applied and electroless plating is performed after catalyst activity has been increased by the preliminary adhesion-promoting treatment, the deposited copper film has an excellent appearance.

Description

technical field [0001] The present invention relates to a copper colloid catalyst solution used as a catalyst for pretreatment when performing electroless copper plating on a non-conductive substrate, an electroless copper plating method using the catalyst solution, and a non-conductive coating of a copper film formed by the method. The conductive substrate provides a technical solution that can significantly improve the stability of the copper catalyst solution over time and impart an excellent appearance to the copper film. Background technique [0002] For conductive substrates represented by copper or copper alloy substrates, or glass-epoxy resin, glass-polyimide resin, epoxy resin, polyimide resin, polycarbonate resin, ABS resin, Resin substrates such as PET resin are representative, and electroless copper plating is carried out on non-conductive substrates including glass substrates, ceramic substrates, etc. The usual method is: firstly, precious metals such as palladi...

Claims

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Application Information

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IPC IPC(8): C23C18/30C23C18/28C23C18/40B01J23/72B01J35/02
CPCB01J23/72C23C18/28C23C18/30C23C18/40B01J35/00B01J35/30C23C18/405C23C18/1639B01J37/0201B01J35/19
Inventor 内田卫田中薰田中雄也
Owner ISHIHARA CHEM
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