Environment-friendly phenolic foam insulation board and preparation method thereof

A phenolic foam and thermal insulation board technology, applied in the field of environment-friendly phenolic foam thermal insulation board and its preparation, can solve the problems of phenolic foam flame retardancy and thermal insulation weakening, etc. The effect of low curing exotherm

Inactive Publication Date: 2017-02-22
NANTONG DEMING PLASTIC NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in general, as the toughness increases, the flame retardant and thermal insulation properties of phenolic foam will be correspondingly weakened.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An environment-friendly phenolic foam insulation board, its components and mass parts are: 100 parts of phenol, 180 parts of formaldehyde, 1 part of boric acid, 10 parts of polyethylene glycol, 10 parts of NaOH, 1 part of citric acid, polyethylene glycol 1 part of diglycidyl ether, 5 parts of surfactant, 20 parts of curing agent, 20 parts of catalyst, 10 parts of foaming agent, and 10 parts of nano carbon black.

[0017] The surfactant is Tween-80, the curing agent is 3-phenylene bisoxazoline, triphosphine, and the foaming agent is a mixture of F113 and N,N-dinitro-5 methylenetetramine.

[0018] A method for preparing an environment-friendly phenolic foam insulation board, the preparation steps are as follows:

[0019] 1) Mix boric acid and polyethylene glycol, heat to 120-150°C, fully react for 3-4h, and cool to 50°C;

[0020] 2) Mix formaldehyde and phenol, slowly add alkaline catalyst NaOH, make the pH value 8-9, heat to make the temperature between 90-100°C, keep w...

Embodiment 2

[0024] An environment-friendly phenolic foam insulation board, its components and mass parts are: 100 parts of phenol, 190 parts of formaldehyde, 2 parts of boric acid, 10 parts of polyethylene glycol, 15 parts of NaOH, 2 parts of citric acid, polyethylene glycol 2 parts of diglycidyl ether, 10 parts of surfactant, 30 parts of curing agent, 30 parts of catalyst, 20 parts of foaming agent, and 15 parts of nano carbon black.

[0025] The surfactant is Tween-80, the curing agent is 3-phenylene bisoxazoline, triphosphine, and the foaming agent is a mixture of F113 and N,N-dinitro-5 methylenetetramine.

[0026] The preparation method is as in Example 1.

Embodiment 3

[0028] An environment-friendly phenolic foam insulation board, its components and mass parts are: 100 parts of phenol, 200 parts of formaldehyde, 3 parts of boric acid, 15 parts of polyethylene glycol, 10 parts of NaOH, 1 part of citric acid, polyethylene glycol 5 parts of diglycidyl ether, 5 parts of surfactant, 25 parts of curing agent, 20 parts of catalyst, 20 parts of blowing agent, 12 parts of nano carbon black.

[0029] The surfactant is Tween-80, the curing agent is 3-phenylene bisoxazoline, triphosphine, and the foaming agent is a mixture of F113 and N,N-dinitro-5methylenetetramine.

[0030] The preparation method is as in Example 1.

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PUM

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Abstract

The invention discloses an environment-friendly phenolic foam insulation board and a preparation method thereof. The insulation board is prepared from, by mass, 100 parts of phenol, 180-210 parts of formaldehyde, 1-5 parts of boric acid, 10-20 parts of polyethylene glycol, 10-20 parts of NaOH, 1-2 parts of citric acid, 1-5 parts of polyethylene glycol bis(2,3-epoxypropyl)ether, 5-10 parts of surface active agent, 20-30 parts of curing agent, 20-30 parts of catalyst, 10-20 parts of foaming agent and 10-15 parts of nano-carbon black. The preparation method includes the steps of firstly, mixing boric acid and polyethylene glycol to prepare boric acid ester; secondly, mixing formaldehyde and phenol to prepare phenolic resin; thirdly, mixing the products in the first step and the second step, adding citric acid to adjust the PH value, adding polyethylene glycol bis(2,3-epoxypropyl)ether to be sufficiently stirred and then depressurized and dewatered; fourthly, conducting compound foaming and demolding. The insulation board has the advantages that the toughness of the phenolic foam board can be improved, and the thermal insulation and flame retardance performance can not be influenced.

Description

technical field [0001] The invention relates to an environment-friendly phenolic foam insulation board and a preparation method thereof. Background technique [0002] The biggest weakness of phenolic foam is its high brittleness and high porosity, so improving its toughness is the key technology to improve the performance of phenolic foam. People have been studying the improvement of brittleness and toughness of phenolic foam board. But in general, when the toughness is improved, the flame retardancy and thermal insulation properties of phenolic foam will be correspondingly weakened. Therefore, there is an urgent need in the market for a method that can improve the toughness of phenolic foam board without affecting its thermal insulation and flame retardancy. Contents of the invention [0003] In order to overcome the above deficiencies, the present invention provides an environment-friendly phenolic foam insulation board that can improve the toughness of the phenolic fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/28C08K5/353C08K3/04C08J9/14C08J9/10C08L61/32
CPCC08G8/28C08J9/10C08J9/108C08J9/144C08J2203/04C08J2203/142C08J2203/184C08J2361/32C08K3/04C08K5/353C08K2201/011
Inventor 范平一郑新宇张圣华张明芬吴丹
Owner NANTONG DEMING PLASTIC NEW MATERIALS
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