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A kind of conductive silver glue, its preparation method and application

A technology of conductive silver glue and conductive particles, used in conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of red zone failure, large thermal expansion coefficient, poor heat resistance of conductive glue, etc. Thermal expansion coefficient, the effect of improving reliability

Active Publication Date: 2019-06-14
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the above defects, the present invention provides a conductive silver glue, its preparation method and application, aiming at the current power chip packaging process due to the poor heat resistance of the conductive glue and the large thermal expansion coefficient.

Method used

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  • A kind of conductive silver glue, its preparation method and application
  • A kind of conductive silver glue, its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment l

[0049] Sequentially weigh bisphenol F epoxy resin 354: 12%; bismaleimide (PDM): 2.4%, allyl bisphenol A ether: 0.6%, hyperbranched polyester modified toughening agent: 3% , and mix it uniformly in a high-speed mixer; then add aromatic amine: 5.5%, benzoyl peroxide: 0.5%, polyamide wax: 0.3%, KH-560 silane coupling agent: 0.3 to the above mixture %, BYK-111: 0.2%, 4-phenylimidazole: 0.2%, continue to mix it evenly in the high-speed mixer; finally add 75% of the silica-silver composite conductive particles to the evenly mixed matrix in batches The resin is fully stirred, and then put into a three-roll mill for grinding and dispersion. After filtering, vacuum defoaming, and packaging, the conductive silver glue with high modulus and low expansion coefficient can be obtained.

Embodiment 2

[0051] Sequentially weigh alicyclic epoxy resin ERL-4221: 3.0 parts; bisphenol A epoxy resin 828E: 9.0 parts; bismaleimide (PDM): 2.4%, allyl bisphenol A ether: 0.6% , hyperbranched polyester modified toughening agent: 3%, and mix it uniformly in a high-speed mixer; then add aromatic amine: 5.5%, benzoyl peroxide: 0.5%, polyamide wax to the above mixture : 0.3%, KH-560 silane coupling agent: 0.3%, BYK-111: 0.2%, 4-phenylimidazole: 0.2%, continue to mix it evenly in the high-speed mixer; finally mix 75% of the Silica-silver composite conductive particles are added to the uniformly mixed matrix resin and stirred thoroughly, then put into a three-roll mill for grinding and dispersing, after filtration, vacuum defoaming, and packaging, high modulus and low expansion coefficient can be obtained. Conductive silver glue.

Embodiment 3

[0053] Sequentially weigh bisphenol F epoxy resin 354: 11.0 parts; bismaleimide (BMI): 3.2%, allyl bisphenol A ether: 0.8%, and mix them uniformly in a high-speed mixer; Then add aromatic amine: 3.8%, benzoyl peroxide: 0.2%, fumed silica: 0.1%, KH-560 silane coupling agent: 0.5%, BYK-337: 0.2%, 4-benzene to the above mixture Imidazole: 0.20%, continue to mix it evenly in the high-speed mixer; finally add 80% of the silica silver composite conductive particles to the mixed matrix resin in batches and stir well, and then put it into the three-roller grinding Grinding and dispersing in a machine, filtering, vacuum defoaming, and packaging, then the conductive silver glue with high modulus and low expansion coefficient can be obtained.

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Abstract

The invention belongs to the technical field of microelectronic packaging, and relates to a conductive silver adhesive, in particular to a conductive silver adhesive and a preparation method and application thereof. The conductive silver adhesive is mainly prepared from, by weight, 50-85% of conductive particles, 10-40% of epoxy resin, 1-20% of maleimide, 0.5-15% of curing agent, 0.01-1.5% of accelerant, 0.01-1% of initiator, 1-10% of flexibilizer and 0.1-3% of functional agent. The sum of the mass percents of the components of the composite is 100%. The conductive particles are of core-shell structures. Compared with a traditional conductive silver adhesive, the thermal expansion coefficient of the conductive silver adhesive is greatly reduced, internal stress damage generated by environment temperature change can be reduced, the reliability of a device is improved, and the conductive silver adhesive is suitable for bonding of various power chips and components.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging, and relates to a conductive silver glue, in particular to a conductive silver glue, its preparation method and application. Background technique [0002] With the rapid development of microelectronics technology and the increasingly broad application prospects, the requirements for the integration of integrated circuits will inevitably become higher and higher. It is the power chip in the IGBT module. As the power increases and the size shrinks, the circuit temperature of the chip continues to rise. Therefore, it is necessary to mount the chip on a heat sink material to improve heat dissipation efficiency. The assembly of the power chip and the heat sink is generally soldered by lead-tin (63Sn / 37Pb) or gold-tin (20Sn / 80Au). Due to the needs of environmental protection, the use of lead-tin solder has been banned worldwide; the cost of gold-tin solder is high. When the temperatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/06C09J11/08
CPCC08L2203/206C09J9/02C09J11/06C09J11/08C09J163/00C08L77/00C08K13/02C08K3/36C08K2003/0806C08K5/3415
Inventor 孙蓉张保坦李金泽朱朋莉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS