Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof

A technology of LED packaging and thermal shock resistance, applied in polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problem of poor compatibility, low penetration rate of LED packaging adhesive, and low reactivity and other problems, to achieve the effect of excellent bonding performance

Inactive Publication Date: 2017-02-22
广东皓明有机硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A POSS modified silicone oil is added to the encapsulation glue. The addition of POSS modified silicone oil not only effectively increases the crosslinking density, but also improves the adhesion to the substrate and heat resistance, but the POSS modified silicone oil has poor compatibility. And the reactivity is low, and the penetration rate of Xunzhi LED encapsulant is low

Method used

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  • Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof
  • Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof
  • Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1 High refraction LED encapsulation adhesive composition

[0034] High refraction LED encapsulation adhesive composition, composed of A component and B component with a weight ratio of 1:1; A component includes the following components and their parts by weight: 30 parts of methyl phenyl vinyl silicone resin, formaldehyde 15 parts of phenylvinyl silicone oil, 0.2 parts of 1,3-dimethyl-1,3-diphenyl-1,3-divinylsiloxane platinum complex, and 0.02 parts of iron-containing alazane complex ; Component B includes the following components and parts by weight: 10 parts of methylphenyl vinyl resin, 35 parts of methylphenyl hydrogen-containing resin, 0.05 parts of 3-methyl-1-pentyn-3-alcohol 1 part, 1 part of borosiloxane oligomer.

[0035] The preparation method includes the following steps: Preparation of component A: Weigh methylphenylvinyl silicone resin and methylphenylvinyl silicone oil in a reaction vessel, stir evenly, add heat-resistant agent and catalyst, stir e...

Embodiment 2

[0036] Embodiment 2 High refraction LED encapsulation adhesive composition

[0037] A high-refractive LED encapsulation adhesive composition is composed of component A and component B in a weight ratio of 1:1; component A includes the following components and their parts by weight: 32 parts of methylphenylvinyl silicone resin, 18 parts of phenylvinyl silicone oil, 0.3 parts of platinum complex of 1,3-dimethyl-1,3-diphenyl-1,3-divinylsiloxane, 0.02 parts of iron-containing silazane complex ; B component includes the following components and parts by weight: 12 parts of methylphenyl vinyl silicone resin, 40 parts of methylphenyl hydrogen-containing silicone resin, 0.08 parts of 3-methyl-1-pentyn-3-alcohol Parts, 1.5 parts of borosiloxane oligomer.

[0038] The preparation method is the same as in Example 1.

Embodiment 3

[0039] Embodiment three high refraction LED encapsulation adhesive composition

[0040] High refraction LED encapsulation adhesive composition, composed of A component and B component with a weight ratio of 1:1; A component includes the following components and their parts by weight: 28 parts of methylphenyl vinyl silicone resin, 14 parts of phenylvinyl silicone oil, 0.2 part of platinum complex of 1,3-dimethyl-1,3-diphenyl-1,3-divinylsiloxane, 0.01 part of iron-containing azane complex ; B component includes the following components and parts by weight: 8 parts of methylphenyl vinyl silicone resin, 32 parts of methylphenyl hydrogen-containing silicone resin, 0.03 parts of 3-methyl-1-pentyn-3-ol 1 part, 1 part of borosiloxane oligomer.

[0041] The preparation method is the same as in Example 1.

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PUM

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Abstract

The invention discloses a thermal shock resistant high-refraction LED packaging glue composition and a preparation method thereof; the LED packaging glue composition is prepared from component A and component B at a weight ratio of 1:1; the component A is prepared from, by weight, 25-35 parts of methyl phenyl vinyl silicone resin, 10-20 parts of methyl phenyl vinyl silicone oil, 0.1-0.3 part of a catalyst, and 0.01-0.03 part of a heat resistant; the component B is prepared from, by weight, 5-15 parts of methyl phenyl vinyl silicone resin, 30-45 parts of methyl phenyl hydrogen-containing silicone resin, 0.02-0.1 part of an inhibitor, and 0.5-3 parts of an adhesion promoter. The invention belongs to the technical field of LED packaging and provides the LED packaging glue composition, having the excellent properties, such as adhesion, thermal shock resistance, permeability, refractivity and hardness, and capable of meeting the requirements of high-power LED packaging.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to a high refraction LED encapsulation adhesive composition resistant to cold and heat shocks and a preparation method thereof. Background technique [0002] Due to the advantages of long life, energy saving, and environmental protection, LED lamps have become a key project for global energy conservation and emission reduction, and incandescent lamps with high energy consumption will gradually withdraw from the stage of history. [0003] At present, LED packaging materials are mainly organic silicon materials, which have the advantages of excellent heat resistance, small internal stress, and no yellowing. With the development of LED packaging technology, the requirements for LED packaging materials are getting higher and higher. The development direction of LED packaging technology mainly includes: high emission efficiency, high reliability, high heat dissipati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/06C09J11/08H01L33/56
CPCC09J183/04C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/06C09J11/08H01L33/56C08L83/04C08K5/0091
Inventor 吴向荣张利利薛俊发程宪涛王佐
Owner 广东皓明有机硅材料有限公司
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