A high temperature resistant high thermal conductivity insulating coating and its preparation process
A preparation process and technology for insulating coatings, applied in the field of high temperature resistant and high thermal conductivity insulating coatings, high temperature resistant and high thermal conductivity insulating coatings, can solve the problems of low working temperature, narrow application range, insufficient adhesion of wear-resistant substrate, etc. Achieve the effect of improving adhesion, not easy to fall off, and strong binding force
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Embodiment 1
[0028] A kind of high temperature resistant high thermal conductivity insulating coating, described coating is made up of the raw material of following mass percent: epoxy modified organosilicon resin 12%, solvent 48%, silane coupling agent 0.7%, filler 39%, curing agent 0.2%, 0.06% of ceramic powder and 0.04% of nano-diamond, wherein the epoxy-modified silicone resin is specifically epoxy-modified silicone resin HG-41.
[0029] In this embodiment, the solvent includes propylene glycol methyl ether acetate, xylene and butyl acetate in a mass ratio of 4:3:3.
[0030] In this embodiment, the filler includes silicon nitride, aluminum oxide, magnesium oxide and boron nitride, and the proportions of the above components in the filler are 70% for silicon nitride, 15% for aluminum oxide, and 10% for magnesium oxide. % and boron nitride 5%.
[0031] In this embodiment, the particle diameters of silicon nitride, aluminum oxide, magnesium oxide and boron nitride are 300-10000 nm.
[0...
Embodiment 2
[0037] A kind of high temperature resistant high thermal conductivity insulating coating, described coating is made up of the raw material of following mass percent: epoxy modified organosilicon resin 15%, solvent 45%, silane coupling agent 0.7%, filler 39%, curing agent 0.2%, 0.05% of ceramic powder and 0.05% of nano-diamond, wherein the epoxy-modified silicone resin is specifically epoxy-modified silicone resin HG-41.
[0038] In this embodiment, the solvent includes propylene glycol methyl ether acetate, xylene and butyl acetate in a mass ratio of 4:3:3.
[0039]In this embodiment, the filler includes silicon nitride, aluminum oxide, magnesium oxide and boron nitride, and the proportions of the above components in the filler are 75% for silicon nitride, 10% for aluminum oxide, and 10% for magnesium oxide. % and boron nitride 5%.
[0040] In this embodiment, the particle diameters of silicon nitride, aluminum oxide, magnesium oxide and boron nitride are 300-10000 nm.
[00...
Embodiment 3
[0046] A kind of high temperature resistant high thermal conductivity insulating coating, described coating is made up of the raw material of following mass percent: epoxy modified organosilicon resin 23%, solvent 35%, silane coupling agent 0.7%, filler 41%, curing agent 0.2%, 0.06% of ceramic powder and 0.04% of nano-diamond, wherein the epoxy-modified silicone resin is specifically epoxy-modified silicone resin HG-41.
[0047] In this embodiment, the solvent includes propylene glycol methyl ether acetate, xylene and butyl acetate in a mass ratio of 4:3:3.
[0048] In this embodiment, the filler includes silicon nitride, aluminum oxide, magnesium oxide and boron nitride, and the proportions of the above components in the filler are 80% for silicon nitride, 8% for aluminum oxide, and 8% for magnesium oxide. % and boron nitride 4%.
[0049] In this embodiment, the particle diameters of silicon nitride, aluminum oxide, magnesium oxide and boron nitride are 300-10000 nm.
[005...
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