Preparing method for lamp packaging conductive adhesive

Abstract

The invention discloses a preparing method for lamp packaging conductive adhesive, and belongs to the technical field of adhesive preparation. The method comprises the steps of adopting fig branches and roots as raw materials, releasing stickum therein by enzymolysis, and obtaining high-viscosity fig tree syrup by vacuum concentration; then blending the tree syrup and conductive carbon black and obtaining electrocondution slurry under the effect of coupling reagent, extracting antioxidant fluid from rosemary residue, compounding the antioxidant fluid with epikote and the electrocondution slurry and obtaining conducting resin component A, using curing agent to prepare component B, and obtaining the packaging conductive adhesive by performing compounding proportionally. The method utilizes high-viscosity active radical groups in the fig tree syrup to improve the number of chemical bonds between the adhesive and matrix, improves binding force so as to ameliorate the problem of the low bonding strength of traditional adhesive, increases the ageing resistance of the adhesive by the antioxidant fluid of the rosemary, and makes up for the defect that the traditional conducting resin gets aged and sheds easily. The compounding of the two components greatly shortens the curing time of the adhesive. The preparing method for lamp packaging conductive adhesive has a good application prospect.

Description

technical field [0001] The invention discloses a method for preparing a conductive adhesive for lamp packaging, and belongs to the technical field of adhesive preparation. Background technique [0002] Conductive adhesive, referred to as conductive adhesive, is an adhesive that can effectively bond various materials and has conductive properties. Conductive adhesive can be divided into two categories: structural type and filling type according to the base composition. The structural type refers to the conductive adhesive in which the polymer material itself is conductive as the matrix of the conductive adhesive; the filled type refers to the conductive adhesive that usually uses the adhesive as the matrix and relies on the addition of conductive fillers to make the glue conductive. At present, the preparation of conductive polymer materials is very complicated, and there is still a long way to go from practical application, so the widely used ones are filled conductive adhe...

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention: Aiming at the defects of low bonding strength, easy aging and falling off of the current common conductive adhesive, and long curing time, the method uses fig branches and roots as raw materials, and releases the viscous substance therein through enzymolysis , concentrated in a vacuum to obtain high-viscosity fig pulp, and then blended the pulp and conductive carbon black under the action of a coupling agent to obtain a conductive paste, then extracted the antioxidant solution from the rosemary residue, and epoxy resin and conductive After the slurry is compounded, the A component of the conductive adhesive is obtained, and then the B component is prepared with a curing agent, and the packaged conductive adhesive is obtained by blending in proportion. The present invention uses the high-viscosity active groups in the fig pulp to increase the adhesive and The number of chemical bonds between the substrates increases the bonding force to improve the low bonding strength of traditional adhesives, and then uses rosemary antioxidant solution to increase the anti-aging properties of adhesives, which also makes up for the traditional conductive adhesives that are easy to age and fall off The defect of the two components blending greatly shortens the curing time of the adhesive, which has excellent application prospects