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Production method of copper foil with low warping value

A technology of low warpage and copper foil, applied in electrolysis process, electroforming, etc., can solve problems such as warpage easily, and achieve the effects of reducing power loss, grain refinement, signal loss and distortion

Inactive Publication Date: 2017-03-29
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] The present invention provides a low-warp copper foil preparation method in view of the current situation that warpage is prone to occur in the existing electrolytic copper foil processing process and the power consumption of copper foil production needs to be rationally controlled.

Method used

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  • Production method of copper foil with low warping value
  • Production method of copper foil with low warping value
  • Production method of copper foil with low warping value

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A method for preparing low warpage copper foil, comprising the steps of:

[0042] 1) Mix and dissolve cathode copper, sulfuric acid and water in proportion to obtain a copper sulfate solution, and adjust to the process range;

[0043] 2) The copper sulfate solution obtained in step 1) is used as an electrolyte to enter an electrolytic cell for electroplating to produce copper foil;

[0044] 3) Turn on the ultrasonic wave, the ultrasonic wave acts on the electrolyte between the cathode roller and the anode plate, and adjust the frequency and sound intensity of the ultrasonic wave according to the process parameters.

[0045] Its process requirements are: Cu 2+ Concentration is 70g / L, H 2 SO 4 The concentration is 80g / L, the electrolyte temperature is 45°C, and the current density is 45A / dm 2 , the additive is gelatin, the added concentration is 2ppm, the ultrasonic frequency is 20KHz, and the sound intensity is 0.05w / cm 2 .

Embodiment 2

[0047] The difference between this embodiment and embodiment 1 is:

[0048] Its process parameter requirements are: Cu 2+ Concentration is 80g / L, H 2 SO 4 The concentration is 80g / L, the electrolyte temperature is 50°C, and the current density is 70A / dm 2 , the additive is gelatin, the added concentration is 8ppm, the ultrasonic frequency is 28KHz, and the sound intensity is 0.09w / cm 2 .

Embodiment 3

[0050] The difference between this embodiment and embodiment 1 is:

[0051] Its process parameter requirements are: Cu 2+ Concentration is 80g / L, H 2 SO 4 The concentration is 120g / L, the electrolyte temperature is 45°C, and the current density is 50A / dm 2 , the additives are gelatin and HEC, the added concentration is 3ppm and 3ppm respectively, the frequency of ultrasonic wave is 26KHz, and the sound intensity is 0.11w / cm 2 .

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Abstract

The invention relates to a production method of copper foil with a low warping value, and belongs to the technical field of manufacturing of the top-grade electrolytic copper foil. In the electrolysis production process of the copper foil, ultrasonic-assisted electro-deposition is exerted, and ultrasonic waves act on electrolytes between a cathode roller and an anode plate. The production method has the beneficial effects that 1, the maximum acceptable concentration of sulfuric acid of the electrolytes can be greatly increased on the premise of guaranteeing the low warping value of the copper foil, the conductivity of the electrolytes can be increased, the cell voltage can be lowered, and therefore the electric energy loss of production of the copper foil can be reduced; and 2, grains of a deposition layer of the copper foil are refined, the Rz value of a rough surface of the copper foil is lowered, signal loss and distortion generated in the signal transmission process with the copper foil as a conductor can be effectively reduced, a copper coating can be more compact, and the ductility and the tensile strength of the copper foil can be improved.

Description

technical field [0001] The invention relates to a method for preparing copper foil, which belongs to the technical field of high-precision electrolytic copper foil manufacture. Background technique [0002] Electrolytic copper foil is the basic material of the electronics industry, and the direct downstream of the electronic material processing industry is the copper clad laminate (CCL) processing plant. In recent years, the manufacturing level of my country's CCL manufacturers has been continuously improved, and the automation level of their equipment has also become higher and higher. Copper foil with large warpage cannot be processed on automatic equipment. In order to meet the needs of automatic production lines of CCL manufacturers, the warpage value of electrolytic copper foil must be controlled. [0003] Studies have shown that the warpage of electrolytic copper foil is mainly due to the internal stress generated during the electrodeposition process, and the internal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04
CPCC25D1/04
Inventor 薛伟杨祥魁徐策徐树民王维河王学江孙云飞宋佶昌徐好强谢锋王其伶冯秋兴朱义刚薛东良
Owner SHANDONG JINBAO ELECTRONICS